A plated article is provided comprising a) a polymeric substrate bearing b) a tie/seed layer in direct contact with the polymeric substrate and c) a plated metal layer, wherein the tie/seed layer has a thickness of less than 0.95 μm, and wherein the tie/seed layer comprises two or more layers of tin alternating with two or more layers of copper, and in some embodiments up to ten or more layers of tin alternating with ten or more layers of copper. In some embodiments, the tie/seed layer includes a layer of tin in direct contact with the polymeric substrate. Typically, the layers of tin and copper comprising the tie/seed layer are sputter coated layers. In some embodiments, the plated metal layer comprises an alloy of copper and tin. In some embodiments, the plated metal layer comprises layers comprised of tin alternating with layers comprised of copper.
PLATED POLYMERIC ARTICLE INCLUDING TIN/COPPER TIE/SEED LAYER
PLATTIERTER POLYMERER ARTIKEL MIT BINDUNGS-/KEIMUNGSSCHICHT AUS ZINN/KUPFER
ARTICLE POLYMÈRE PLAQUÉ COMPORTANT UNE COUCHE DE LIAISON/GERMINATION EN ÉTAIN/CUIVRE
2019-08-21
Patent
Electronic Resource
English
IPC: | B64D Ausrüstung für Flugzeuge , EQUIPMENT FOR FITTING IN OR TO AIRCRAFT / C23C Beschichten metallischer Werkstoffe , COATING METALLIC MATERIAL / C25D Verfahren für die elektrolytische oder elektrophoretische Herstellung von Überzügen , PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS |
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