The invention discloses a centralized heat dissipation structure of a charging and distribution three-in-one controller. The centralized heat dissipation structure comprises a circuit board assembly (1), an aluminum alloy heat conduction tank (2), a pressing sheet (3) and a heat dissipation base (4), inductors, transformers and MOS (metal oxide semiconductor) tubes needing heat dissipation on a circuit board assembly are arranged in a centralized manner, the inductors, the transformers and the MOS tubes needing heat dissipation are arranged in an aluminum alloy heat conduction tank (2), the aluminum alloy heat conduction tank (2) is filled with pouring sealant, and finally heat of the inductors, the transformers and the MOS tubes is conducted to a heat dissipation base (4) through the aluminum alloy heat conduction tank (2) for heat dissipation. The centralized heat dissipation structure has a better heat dissipation effect on the components, and meanwhile, due to the compact structural design, the overall size of the case is smaller, the cost is low, and the maintenance is easy.
本发明公开了一种一种充配电三合一控制器集中式散热结构,包括:电路板总成(1)、铝合金导热罐(2)、压片(3)、散热底座(4);本发明将电路板总成上需要散热的电感、变压器、MOS管集中布置,在将需要散热的电感、变压器、MOS管装入铝合金导热罐(2)内,并将铝合金导热罐(2)注满灌封胶,最后通过铝合金导热罐(2)将电感、变压器、MOS管热量传导到散热底座(4)进行散热;此种集中散热结构对元器件散热的效果会更好,同时紧凑的结构设计,机箱的整体尺寸更小,成本低、易维护。
Centralized heat dissipation structure of charging and distribution three-in-one controller
一种充配电三合一控制器集中式散热结构
2023-09-05
Patent
Electronic Resource
Chinese
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