Abstract This paper presents two transitions between microstrip and stripline in Low Temperature Co-fired Ceramic technology, including a vertical transition and a coplanar transition for millimeter-wave application. These interconnects are simulated and optimized by a three-dimensional electromagnetic field simulator. Simulation results show that the return loss of microstrip to stripline vertical transition is less than −22dB, and insertion losses are greater than 0.5dB up to 35GHz, and greater than 1dB up to 40GHz. Similarly, the return loss of the coplanar transition is less than −32dB and insertion loss is better than 0.5dB. LTCC test structures were fabricated and the performance of all transitions was successfully validated by scattering parameter measurements up to 40GHz.
Highlights Two transitions between microstrip and stripline in LTCC are proposed. Parasitic effect and modes excited by discontinuity degrade electrical performance. Metal-filled via holes can suppress parasitic modes excited by the discontinuity. Filed-matching method is a good method to improve the performance of transitions. Shaping ground technique and additional vias can improve performance of transitions.
Novel design for microstrip to stripline transitions for millimeter-wave application in LTCC
Acta Astronautica ; 104 , 1 ; 256-259
2014-08-01
4 pages
Article (Journal)
Electronic Resource
English
Novel design for microstrip to stripline transitions for millimeter-wave application in LTCC
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