There has been considerable interest in stratospheric airships that have their unique role in environmental monitoring and surveillance, communication transmission, and carrying weapons, among other uses. The problem presented in this paper is that the test values of pressure resistance are far from the theoretical values of spherical balls, which are made up of plain-weave fabrics. In this paper, the uniaxial tension in structural layers has been tested to certify the validity of the finite element analysis (FEA) models. A boundary condition that is suitable for airship envelope simulation analysis is also proposed here. Using the secondary development function of Abaqus, an FEA model of three-dimensional plain-weave fabric is then established to simulate the envelope inflation experiments. Finally, the stress behavior of the microstructure of plain-weave fabric is summarized, and several conclusions are obtained.


    Access

    Check access

    Check availability in my library

    Order at Subito €


    Export, share and cite



    Title :

    Finite Element Simulation of the Microstructure of Stratospheric Airship Envelopes


    Contributors:

    Published in:

    AIAA Journal ; 58 , 8 ; 3690-3699


    Publication date :

    2020-04-16


    Size :

    10 pages




    Type of media :

    Article (Journal)


    Type of material :

    Electronic Resource


    Language :

    English




    Airship capsule and stratospheric airship

    DUAN YI / JIANG JING / FU GONGYI et al. | European Patent Office | 2023

    Free access

    TRANSFORMABLE STRATOSPHERIC AIRSHIP

    ZHOU MENG / TAN BAIHE / XU ZHONGXIN et al. | European Patent Office | 2021

    Free access

    Stratospheric airship fabric

    Emerald Group Publishing | 2007


    Transformable stratospheric airship

    ZHOU MENG / TAN BAIHE / XU ZHONGXIN et al. | European Patent Office | 2022

    Free access

    Semi-hard stratospheric airship framework and semi-hard stratospheric airship

    WANG ZENGJIA / FU GONGYI / DUAN MIYI et al. | European Patent Office | 2020

    Free access