Flip chip technology, flip chip underfilling, substrate integrated housing, thermal bumps, GaAs power devices, aluminium nitride, polyimide, au-bumps, RF-characterization, thermal resistance, insertion loss, reflection loss


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    Title :

    Physik und Basistechnologien von Dünnfilm-Solarzellen aus kristallinem Silizium auf Glassubstraten : Abschlußbericht zum BMBF Projekt 0329634, Laufzeit: 01.01.95 - 31.3.98


    Additional title:

    Physics and technologies for thin film solar cells from crystalline silicon on glass substrates



    Edition :

    [Electronic ed.]


    Publication date :

    1998


    Size :

    110 p. = 5,9 MB, text and images


    Remarks:

    Contract no. BMBF 16 SV 163/5
    Differences between the printed and electronic version of the document are possible
    Digital preservation by Technische Informationsbibliothek (TIB) / Leibniz-Informationszentrum Technik und Naturwissenschaften und Universitätsbibliothek


    Type of media :

    Report


    Type of material :

    Electronic Resource


    Language :

    German , English



    Classification :

    BKL:    53.36 Energiedirektumwandler, elektrische Energiespeicher