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    Title :

    Advances in electronic packaging, 1993 : proceedings of the 1993 ASME International Electronics Packaging Conference / sponsored by the American Society of Mechanical Engineers. Ed. by Peter A. Engel ... ; Vol. 1: Structural analysis materials and process



    Conference:

    ASME International Electronics Packaging Conference ; 2 ASME International Electronics Packaging Conference ; 2 (Binghamton, N.Y.) : 1993.09-10.02


    Published in:

    EEP ; 4,1


    Publication date :

    1993


    Size :

    XI, 549 S


    Remarks:

    Ill



    Type of media :

    Conference Proceedings


    Type of material :

    Print


    Language :

    English


    Keywords :

    Classification :

    DDC:    621.381/046
    BKL:    53.33 Elektrische Maschinen und Antriebe




    Proceedings of the 1993 IEEE/ASME Joint Railroad Conference, April 6 - 8, 1993, Pittsburgh, Pennsylvania

    Joint Railroad Conference / Institute of Electrical and Electronics Engineers / American Society of Mechanical Engineers | TIBKAT | 1993