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    Title :

    Novel Materials as Interlayer Low-K Dielectrics for CMOS Interconnect Applications


    Contributors:

    Conference:

    International conference; 2nd, Mechanical and aerospace engineering; (ICMAE) 2011) ; 2011 ; Bangkok, Thailand



    Publication date :

    2012-01-01


    Size :

    4 pages


    Remarks:

    Includes bibliographical references and index.




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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