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    Title :

    Material Characterization and Die Stress Measurement of Low Expansion PCB for Extreme Environments


    Contributors:
    Copeland, D. S. (author) / Rahim, M. K. (author) / Islam, M. S. (author) / Suhling, J. C. (author) / Jaeger, R. C. (author) / Lall, P. (author) / Tian, G. (author) / Vasoya, K. (author) / IEEE

    Conference:

    IEEE aerospace conference ; 2005 ; Big Sky, MT



    Publication date :

    2005-01-01


    Size :

    19 pages


    Remarks:

    IEEE cat no 05TH8788




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English






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