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    Title :

    Micro-moire for thermal deformation investigation in electronics packaging [4596-38]



    Conference:

    Conference; 2nd, Advanced photonic sensors and applications ; 2000 ; Singapore



    Publication date :

    2001-01-01


    Size :

    5 pages




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




    High-resolution micro-moire methods: principles and applications [4596-40]

    Asundi, A. K. / Xie, H. / Boay, C. G. et al. | British Library Conference Proceedings | 2001


    Nr. 4596

    DataCite | 1933


    Multichannel 3D profilometry [4596-27]

    Li, C. / Asundi, A. K. / Fang, Z. P. et al. | British Library Conference Proceedings | 2001


    Dynamic phase-shift photoelasticity [4596-44]

    Liu, T. / Boay, C. G. / Asundi, A. K. et al. | British Library Conference Proceedings | 2001


    Characterization of electronic packaging materials and components by image correlation methods [4596-36]

    Vogel, D. / Auersperg, J. / Michel, B. et al. | British Library Conference Proceedings | 2001