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    Title :

    The Effects of Solder Voids in the Device to Substrate Interface for Electric Vehicle and Other Power Applications



    Conference:

    Workshop, Power electronics in transportation ; 1996 ; Dearborn; MI



    Publication date :

    1996-01-01


    Size :

    6 pages


    Remarks:

    IEEE cat no 96TH8184



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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