1–20 von 179 Ergebnissen
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    Yield Estimation Through Component Placement Accuracy Evaluation in Surface Mount PWB Assembly

    Shih, W. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    Wire bond parameter optimization study

    Viloria, E. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    What are the design and manufacturing couplings for electronics products?

    Williams, D. J. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Tolerance analysis and synthesis across assemblies : state-of-the-art review

    Ngoi, Bryan Kok Ann | Online Contents | 1994
    Verlag: World Scientific , Singapore

    The use of electronic speckle pattern interferometry in electronics manufacturing process modelling

    Ogunjimi, A. O. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    The Solderability Evaluation of Surface Mount Components Through the Use of Wetting Balance Analysis

    Huang, C.-Y. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    The Singapore and Malaysia Electronics Industries : D. Beane, A. Shukla and M. Pecht (Book review)

    Tilley, K. J. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    The significance of desoldering and resoldering methods in robotic automated rework

    Geren, N. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Thermal Model of a Component Package for System Level Applications

    Teng, S. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Thermal Management for the Robustness Improvement of Double Sided SMT Solder Reflow

    Lee, N. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    THERMAL DISSIPATION CHARACTERISTICS OF A TAPE AUTOMATED BONDING ELECTRONIC PACKAGE

    Yang, L. Y. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    Thermal analysis of IC packages and printed circuit boards

    Tay, A. A. O. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    The Performance of Vibrating Squeegee in the Stencil Printing of Solder Pastes

    Ekere, N. N. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    The Origin and Prevention of Post Reflow Defects in Surface Mount Assembly

    Teo, K. C. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    The Limits of Automating Electronic Component Rework

    Geren, N. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    The Impacts of Variability on Scheduling Approaches for a Printed Wiring Boaxd Assembly Operation

    Pfund, M. | Online Contents | 2002
    Verlag: World Scientific , Singapore

    The "Green Design Advisor": A Tool for Design for Environment

    Feldmann, K. | Online Contents | 1999
    Verlag: World Scientific , Singapore

    The EPSRC/D & IPG electronics assembly sector workshop

    Williams, D. J. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    The Electrical and Mechanical Properties of Electrically Conductive Adhesives in Pin-Through-Hole Applications

    Morris, J. E. | Online Contents | 1996
    Verlag: World Scientific , Singapore