1–20 von 26 Ergebnissen
|

    Vibration-induced fatigue failures in bonding wires used in stacked chip modules

    Leidecker, H. / Hull, S. | Tema Archiv | 1998
    Schlagwörter: Gold

    Ultra Precision Machining of the Winston Cone Baffle for Space Observation Camera

    Yang, Sun-Choel / Kim, Geon-Hee / Huh, Myung-Sang et al. | Tema Archiv | 2012
    Schlagwörter: Gold

    The technical advantages of IFTE over its predecessors

    Ucci, R.M. / Romania, J.J. jun. | Tema Archiv | 1987
    Schlagwörter: GOLD-DOT SYSTEM INTERFACE

    The synergistic relationship of stresses in the automotive connector

    Swingler, J. / McBride, J.W. | Tema Archiv | 1998
    Schlagwörter: Gold

    Thermoelectric infrared imaging sensors for automotive applications

    Hirota, M. / Nakajima, Y. / Saito, M. et al. | Tema Archiv | 2004
    Schlagwörter: Gold

    Surface treatments of aluminium for space applications

    Puippe, J.C. | Tema Archiv | 1997
    Schlagwörter: Gold

    Short arc duration laws and distributions at low current (<1A) and voltage (14 -42VDC)

    Jemaa, N.B. / Lehfaoui, L. / Nedelec, L. | Tema Archiv | 2000
    Schlagwörter: Gold

    Scarce metals in Swedish end-of-life vehicle recycling

    Andersson, M. / Ljunggren Söderman, M. / Sanden, B.A. | Tema Archiv | 2014
    Schlagwörter: Gold

    Reliability of Au/Al bonding in plastic packages for high temperature (200 degrees C) and high current applications

    Passagrilli, C. / Gobbato, L. / Tiziani, R. | Tema Archiv | 2002
    Schlagwörter: Gold

    Preparation of Al2O3/DLC/Au/MoS2 chameleon coatings for space and ambient environments

    Baker, C.C. / Hu, J.J. / Voevodin, A.A. | Tema Archiv | 2006
    Schlagwörter: Gold

    Possibilities of fretting corrosion model testing for contact surfaces of automotive connectors

    Buresch, I. / Rehbein, P. / Klaffke, D. | Tema Archiv | 2001
    Schlagwörter: Gold

    Performance of the gold-tin connector interface in a flight environment

    Abbott, W.H. | Tema Archiv | 1998
    Schlagwörter: Gold

    Low voltage contact charging of hydrocarbon fluids

    Cole, J.D. | Tema Archiv | 1978
    Schlagwörter: GOLD

    Leadless carrier applications for avionics packaging

    Bauer, J.A. | Tema Archiv | 1977
    Schlagwörter: GOLD

    Lead-free solder bumping process for high temperature automotive application

    Teutsch, T. / Blankenhorn, R.G. / Zakel, E. | Tema Archiv | 2003
    Schlagwörter: Gold

    High-reliability low-cost gold plating connector

    Kamo, T. / Inaoka, H. / Kato, T. et al. | Tema Archiv | 1993
    Schlagwörter: Gold