251–300 von 567 Ergebnissen
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    A Study of Solderability and Solder Spreading for SMT Open Joints

    Teo, K. C. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    Hierarchical Renormalisation and Stretched Exponential Relaxations

    Souletie, J. | British Library Conference Proceedings | 1996
    Verlag: World Scientific , Singapore

    Novel Magnetic-Field-Induced Minigap and Transport in Coupled Double QuantumWells

    Lyo, S. K. / Simmons, J. A. / Harff, N. E. et al. | British Library Conference Proceedings | 1996
    Verlag: World Scientific , Singapore

    ELECTRICAL CONDUCTION MODELS FOR ISOTROPICALLY CONDUCTIVE ADHESIVES

    Li, Li | Online Contents | 1995
    Verlag: World Scientific , Singapore

    Analyzing the Natural Resting Aspects of a Component by its Centroid Solid Angle

    Ngoi, B. K. A. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    Optimization of a Copper Pattern Plating Process with Planned Experimentation and Response Surface

    Poon, G. K. K. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    The Electrical and Mechanical Properties of Electrically Conductive Adhesives in Pin-Through-Hole Applications

    Morris, J. E. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    High-Frequency Analog Integrated Circuit Design : Ravender Goyal, Ed. (Book review)

    Edwards, T. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    Yield Estimation Through Component Placement Accuracy Evaluation in Surface Mount PWB Assembly

    Shih, W. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    Pan Asian Electronic Business '94

    Souza, R. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Computer simulation of solder paste flow, part II : Flow out of a stencil aperture

    Mannan, S. H. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Application of ink screening models to solder paste printing in SMT assembly

    Mannan, S. H. | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Wind Experiments

    Moeller, J. T. / International Centre for Theoretical Physics / University of Khartoum | British Library Conference Proceedings | 1989
    Verlag: World Scientific , Singapore

    Stencil Optimization via Flow Control

    Teo, K. C. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    A Model to Explain SMT Open Circuit Joints Associated with Adjacent Solder Bridges

    Whalley, D. C. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    FLOW MODELING OF PQFP DURING TRANSFER MOLDING

    Kuah, T. H. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    EXPERIMENTAL STUDY OF SOLDER JOINT RELIABILITY IN A 256 PIN, 0.4 MM PITCH PQFP

    Yeo, C. K. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    A Computational Model for Forced Convection Cooling in Electronic Components

    Olivos, T. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    A Review of PCB Design for In-Circuit Testability Guidelines and Systems

    Gallagher, C. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    Electric Properties of Connections by Anisotropic Conductive Film

    Shiozawa, N. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    The Performance of Vibrating Squeegee in the Stencil Printing of Solder Pastes

    Ekere, N. N. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    Parameter Interactions in Stencil Printing of Solder Paste

    Haslehurst, L. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    The development of electrorheological fluids for an automotive semi-active suspension system

    Weyenberg, T.R. / Pialet, J.W. / Petek, N.K. | Tema Archiv | 1996
    Verlag: World Scientific , Singapore

    An intelligent decision support environment for PCB assembly

    Soon, Chong Chin | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Implementation of a decision support system for scheduling semiconductor test operations

    Lee, Chung-Yee | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Wind Tunnel Modeling of Sand Transport Physics and Control

    Iversen, J. D. / International Centre for Theoretical Physics / University of Khartoum | British Library Conference Proceedings | 1989
    Verlag: World Scientific , Singapore

    A Physically Based Wind Erosion Estimation Method

    Gillette, D. A. / International Centre for Theoretical Physics / University of Khartoum | British Library Conference Proceedings | 1989
    Verlag: World Scientific , Singapore

    Adhesive Flip Chip Bonding in a Miniaturized Spectrometer

    Rusanen, O. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Application of Dielectric Binary Mixtures in Electronic Cooling Nucleate Pool Boiling Regime

    Lee, T.-Y. T. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Automatic Process Planning System for the Manufacture of Unpopulated Printed Circuit Boards

    Law, H. -W. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    FLIP-CHIP INTERCONNECTION TO VARIOUS SUBSTRATES USING ANISOTROPIC CONDUCTIVE ADHESIVE FILMS

    Watanabe, Itsuo | Online Contents | 1995
    Verlag: World Scientific , Singapore

    Solder Wire Die Bond Process Characterisation Study

    Tan, C. U. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    IN SITU STUDY OF SOLDER PASTE BEHAVIOR DURING REFLOW USING THE HOT-STAGE ENVIRONMENTAL SCANNING ELECTRON MICROSCOPE

    Natishan, M. E. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Effects of Gap Height on Conduction within Anisotropic Conducting Adhesive Assemblies

    Mannan, S. H. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    A low-cost automated handling system for SPC evaluation of packaging processes

    Yeo, S. H. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Joining of displays using thermosetting anisotropically conductive adhesives

    Liu, Johan | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Development goals and present status of 3M's adhesive interconnection technology

    Hogerton, Peter B. | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Properties of anisotropic conductive adhesive pastes for fine-pitch surface mount technology

    Goward, John M. | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Debonding of adhesively joined electronic circuits for recycling

    Hartwig, A. | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Proposal for Monitoring Sand Dunes Movement by Remote Sensing

    Hassan, H. M. / International Centre for Theoretical Physics / University of Khartoum | British Library Conference Proceedings | 1989
    Verlag: World Scientific , Singapore

    Qualify lmprovement in a Printed Circuit Board Manufacturer: A Case Study Examination

    DeWsbury, M. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    Environmental Factors in Parametric Design of Computer Chassis

    Sheng, P. S. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    An Approximate Model for Predicting the Size and Shape of Wave-Soldered Surface-Mount Joints

    Nambisan, B. U. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    Advanced superfine-pitch technology

    Wakigawa, Asahiro | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Particle identification system for semiconductor manufacturing

    Katayama, Hiroshi | Online Contents | 1994
    Verlag: World Scientific , Singapore

    The significance of desoldering and resoldering methods in robotic automated rework

    Geren, N. | Online Contents | 1994
    Verlag: World Scientific , Singapore