A Study of Solderability and Solder Spreading for SMT Open Joints
Hierarchical Renormalisation and Stretched Exponential Relaxations
Novel Magnetic-Field-Induced Minigap and Transport in Coupled Double QuantumWells
ELECTRICAL CONDUCTION MODELS FOR ISOTROPICALLY CONDUCTIVE ADHESIVES
Analyzing the Natural Resting Aspects of a Component by its Centroid Solid Angle
Optimization of a Copper Pattern Plating Process with Planned Experimentation and Response Surface
High-Frequency Analog Integrated Circuit Design : Ravender Goyal, Ed. (Book review)
Yield Estimation Through Component Placement Accuracy Evaluation in Surface Mount PWB Assembly
Computer simulation of solder paste flow, part II : Flow out of a stencil aperture
Application of ink screening models to solder paste printing in SMT assembly
A Model to Explain SMT Open Circuit Joints Associated with Adjacent Solder Bridges
FLOW MODELING OF PQFP DURING TRANSFER MOLDING
EXPERIMENTAL STUDY OF SOLDER JOINT RELIABILITY IN A 256 PIN, 0.4 MM PITCH PQFP
A Computational Model for Forced Convection Cooling in Electronic Components
A Review of PCB Design for In-Circuit Testability Guidelines and Systems
Electric Properties of Connections by Anisotropic Conductive Film
The Performance of Vibrating Squeegee in the Stencil Printing of Solder Pastes
Parameter Interactions in Stencil Printing of Solder Paste
The development of electrorheological fluids for an automotive semi-active suspension system
An intelligent decision support environment for PCB assembly
Implementation of a decision support system for scheduling semiconductor test operations
Wind Tunnel Modeling of Sand Transport Physics and Control
A Physically Based Wind Erosion Estimation Method
Adhesive Flip Chip Bonding in a Miniaturized Spectrometer
Application of Dielectric Binary Mixtures in Electronic Cooling Nucleate Pool Boiling Regime
Automatic Process Planning System for the Manufacture of Unpopulated Printed Circuit Boards
FLIP-CHIP INTERCONNECTION TO VARIOUS SUBSTRATES USING ANISOTROPIC CONDUCTIVE ADHESIVE FILMS
Solder Wire Die Bond Process Characterisation Study
Effects of Gap Height on Conduction within Anisotropic Conducting Adhesive Assemblies
A low-cost automated handling system for SPC evaluation of packaging processes
Joining of displays using thermosetting anisotropically conductive adhesives
Development goals and present status of 3M's adhesive interconnection technology
Properties of anisotropic conductive adhesive pastes for fine-pitch surface mount technology
Debonding of adhesively joined electronic circuits for recycling
Proposal for Monitoring Sand Dunes Movement by Remote Sensing
Qualify lmprovement in a Printed Circuit Board Manufacturer: A Case Study Examination
Environmental Factors in Parametric Design of Computer Chassis
An Approximate Model for Predicting the Size and Shape of Wave-Soldered Surface-Mount Joints
Particle identification system for semiconductor manufacturing
The significance of desoldering and resoldering methods in robotic automated rework