Leistungselektronik - Herausforderungen und Trends für die Aufbau- und Verbindungstechnik
Comparison of the power dissipation with modern semiconductor devices in zero voltage switching
Joining and package technology for 175 °C Tj increasing reliability in automotive applications
Bewertung der Störaussendung von Hochvolthalbleitern für Elektrofahrzeuge
In situ Defect-screening of Integrated LDMOS for Critical Automotive Applications
New on-chip screening of gate oxides smart power devices for automotive applications
Styling and design - the real driving forces for LED technology
Herausforderung Hochtemperaturelektronik. Vom BMBF-Verbundprojekt zum ZVEI-Arbeitskreis
Microelectronics for space applications - challenges and opportunities
High efficiency, high reliability 2 kW inverter for aeronautical application
Power semiconductor devices - development trends and system interactions
Bipolar phototransistors reliability assessment for space applications