1–50 von 214 Ergebnissen
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    Thermoelectric energy conversion devices and systems

    Yazawa, Kazuaki / Bahk, Je-Hyeong / Šakūrī, ʿAlī | TIBKAT | 2021
    Verlag: World Scientific , Singapore

    Guidance, navigation and control : an international journal of Technical Committee on Guidance, Navigation and Control, CSAA

    Zhong guo hang kong xue hui, Technical Committee on Guidance, Navigation and Control | TIBKAT | Volume 1, number 1 (March 2021)-
    Verlag: World Scientific , Singapore

    Journal of electronics manufacturing : JEM

    TIBKAT | Nachgewiesen 9.1999 -
    Verlag: World Scientific Publ. , Singapore

    Journal of electronics manufacturing

    TIBKAT | 1.1991 - 11.2002,2
    Verlag: World Scientific , Singapore , London

    Hybrid fuel cell power for long duration robot missions in field environments

    Thangavelautham, Jekanthan / Gallardo, Danielle / Strawser, Daniel et al. | Tema Archiv | 2011
    Verlag: World Scientific , Singapore

    Autolanding controller design using adaptive control

    Malaek, S.M.B. / Izadi, Hojjat / Pakmehr, Mehrdad | Tema Archiv | 2004
    Verlag: World Scientific , Singapore

    Photonics in space : advanced photonic devices and systems

    Ciminelli, Caterina / Dell'Olio, Francesco / Armenise, Mario Nicola | SLUB | 2016
    Verlag: World Scientific , New Jersey

    Scanning probe microscopy for energy research

    Bonnell, Dawn A. / Kalinin, Sergei V. | TIBKAT | 2013
    Verlag: World Scientific , Singapore [u.a.]

    GIS-based real-time correction of deviation on vehicle track

    Bao, Yuanlu / Liu, Yan / Wang, Sheng-Guo | Tema Archiv | 2004
    Verlag: World Scientific , Singapore

    Principles of solar cells : connecting perspectives on device, system, reliability, and data science

    Alam, Muhammad Aftab / Khan, M. Ryyan | TIBKAT | 2022
    Verlag: World Scientific$h , New Jersey

      Principles of solar cells : connecting perspectives on device, system, reliability, and data science

      Alam, Muhammad Aftab / Khan, M. Ryyan | TIBKAT | 2022
      Verlag: World Scientific , New Jersey , London , Singapore$aBeijing$aShanghai$aHong Kong$aTaipei$aChennai$aTokyo

    Acoustic guided waves interdigital transducers for non destructive testing of carbon-epoxy composites for spacecraft structures

    Bellan, F. / Bulletti, A. / Capineri, L. et al. | Tema Archiv | 2004
    Verlag: World Scientific , Singapore

    Component to Multi-Track Feeder Assignment and Boaxd Sequencing in Printed Circuit Boaxd Assembly

    Li, Y.A. | Online Contents | 2002
    Verlag: World Scientific , Singapore

    The Impacts of Variability on Scheduling Approaches for a Printed Wiring Boaxd Assembly Operation

    Pfund, M. | Online Contents | 2002
    Verlag: World Scientific , Singapore

    Economic Sensitivity for End of Life Planning and Processing of Personal Computers

    Boon, J.E. | Online Contents | 2002
    Verlag: World Scientific , Singapore

    Modeling of Material Handling Hoist Operations in a PCB Manufacturing Facility

    Mak, R.W.T. | Online Contents | 2002
    Verlag: World Scientific , Singapore

    Scheduling of Printed Wiring Board Assembly in Surface Mount Technology Lines

    Sawik, T. | Online Contents | 2002
    Verlag: World Scientific , Singapore

    Optimization of PCB Component Placement Using Genetic Algorithms

    Jeevan, K. | Online Contents | 2002
    Verlag: World Scientific , Singapore

    Neural Network Open Loop Control System for Wave Soldering

    Coit, D.W. | Online Contents | 2002
    Verlag: World Scientific , Singapore

    Clean electricity from photovoltaics

    Archer, Mary D. / Green, Martin A. | TIBKAT | 2015
    Verlag: World Scientific Publ. , Singapore , London

    Direct Immersion Cooled Microelectronics Heat Sinks: Effects of Test Fluid and Bonding Technique

    Bhavnani, S.H. | Online Contents | 2000
    Verlag: World Scientific , Singapore

    Analytical Forced Convection Modeling of Plate Fin Heat Sinks

    Teeristra, P. | Online Contents | 2000
    Verlag: World Scientific , Singapore

    Evaluation of Plasma Treated HASL Finish PCBs Using DCA Measurements

    Takyi, G. | Online Contents | 2000
    Verlag: World Scientific , Singapore

    Models to Estimate Printed Circuit Board Fabrication Yield During the Design Stage

    Giachetti, R. E. | Online Contents | 2000
    Verlag: World Scientific , Singapore

    Paxametric Studies of Microchannel Conjugate Liquid Flows with Zeta Potential Effects

    Ng, E.Y.K. | Online Contents | 2000
    Verlag: World Scientific , Singapore

    Analysis and Experiments of Ball Deformation for Ultra-Fine-Pitch Wire Bonding

    Zhong, Z. | Online Contents | 2000
    Verlag: World Scientific , Singapore

    Screen Printing Process Design of Experiments for Fine Line Printing of Thick Film Ceramic Substrates

    Pan, J. | Online Contents | 2000
    Verlag: World Scientific , Singapore

    Design Considerations of High Heat Flux Heat Pipe Evaporators

    Zuo, Z.J. | Online Contents | 2000
    Verlag: World Scientific , Singapore

    Properties of Conductive Adhesives Based on Anhydride-Cured Epoxy Systems

    Lu, D. | Online Contents | 2000
    Verlag: World Scientific , Singapore

    Printed Circuit Board Manufacturing and Testing of RIMM[TM]

    Lau, J. | Online Contents | 2000
    Verlag: World Scientific , Singapore

    Computer Take-back and Recycling: An Economic Analysis for Used Consumer Equipment

    Jung, L. B. | Online Contents | 1999
    Verlag: World Scientific , Singapore

    Electronic Products at their End-of-Life: Options and Obstacles

    Linton, J. | Online Contents | 1999
    Verlag: World Scientific , Singapore

    A Framework for the Flexible Grouping of Products for Disassembly

    Viswanathan, S. | Online Contents | 1999
    Verlag: World Scientific , Singapore

    The "Green Design Advisor": A Tool for Design for Environment

    Feldmann, K. | Online Contents | 1999
    Verlag: World Scientific , Singapore

    Product End-of-Life Strategy Categorization Design Tool

    Rose, C. M. | Online Contents | 1999
    Verlag: World Scientific , Singapore

    A Study on Wettability and Defects Behavior of Flow-Soldered Joint Using Low Residue Flux

    Choi, M. K. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    Efficient Heuristics for Drilling Route Optimization in Printed Circuit Board Manufacturing

    Linn, R. J. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    Solder Paste Tests for the 'AART' Process

    Murthy, S. T. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    The Singapore and Malaysia Electronics Industries : D. Beane, A. Shukla and M. Pecht (Book review)

    Tilley, K. J. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    Analysis of Design Efficiency for the Disassembly of Modular Electronic Products

    Veerakamolmal, P. | Online Contents | 1999
    Verlag: World Scientific , Singapore

    SMT Compatible No-Flow Underfill for Solder Bumped Flip Chip on Low-Cost Substrates

    Lau, J. H. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    Micro-Jet Printing of Polymers and Solder for Electronics Manufacturing

    Hayes, D. J. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    A Practical Algorithm for Cyclic Hoist Scheduling in a PCB Manufacturing Facility

    Mak, R. W. T. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    Finite Element Modeling of Heat Transfer in Chip on Tape Packages

    Yang, L. Y. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    Modeling of Acid Copper Electroplating : A Review

    Poon, G. K. K. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    An Experimental Study of the Self Centering of BGA Packages

    Huang, Y.-W. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Integrated Modeling of Electronics Assembly Systems by Colored Petri Nets

    Tam, H.-Y. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Analysis of Underfill Encapsulation Curing Deformations on Flip Chip on Boaxd (FCOB) Package Reliability

    Pang, J. H. L. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    PCB Assembly Line Setup Optimization Using Component Commonality Matrices

    Dillon, S. | Online Contents | 1998
    Verlag: World Scientific , Singapore