Yield Estimation Through Component Placement Accuracy Evaluation in Surface Mount PWB Assembly
Wire bond parameter optimization study
What are the design and manufacturing couplings for electronics products?
Tolerance analysis and synthesis across assemblies : state-of-the-art review
The use of electronic speckle pattern interferometry in electronics manufacturing process modelling
The Solderability Evaluation of Surface Mount Components Through the Use of Wetting Balance Analysis
The Singapore and Malaysia Electronics Industries : D. Beane, A. Shukla and M. Pecht (Book review)
The significance of desoldering and resoldering methods in robotic automated rework
Thermoelectric energy conversion devices and systems
Thermal Model of a Component Package for System Level Applications
Thermal Management for the Robustness Improvement of Double Sided SMT Solder Reflow
THERMAL DISSIPATION CHARACTERISTICS OF A TAPE AUTOMATED BONDING ELECTRONIC PACKAGE
Thermal analysis of IC packages and printed circuit boards
The Performance of Vibrating Squeegee in the Stencil Printing of Solder Pastes
The Origin and Prevention of Post Reflow Defects in Surface Mount Assembly
The Limits of Automating Electronic Component Rework
The Impacts of Variability on Scheduling Approaches for a Printed Wiring Boaxd Assembly Operation