A "Closed Loop'' System for the Realtime Control of Solder Paste Stencil Printing
A Computational Model for Forced Convection Cooling in Electronic Components
A continuously variable ER damper with energy generation
A Decision-Support Tool for Printed Circuit Board Assembly
Adhesive Flip Chip Bonding in a Miniaturized Spectrometer
Adhesive Flip Chip Bonding on Flexible Substrates
A Framework for the Flexible Grouping of Products for Disassembly
A fuzzy management decision support system for scenario analysis
A low-cost automated handling system for SPC evaluation of packaging processes
Alternative substrates for power electronic circuits : an experimental evaluation
A Model to Explain SMT Open Circuit Joints Associated with Adjacent Solder Bridges
Analysing the strategic implications of interconnect technologies
Analysis and Experiments of Ball Deformation for Ultra-Fine-Pitch Wire Bonding
Analysis of Design Efficiency for the Disassembly of Modular Electronic Products
Analysis of despatching policies in semiconductor post-test operations
ANALYSIS OF NATURAL RESTING ASPECTS OF COMPLEX PARTS
Analysis of Process Errors and Production Yield for Surface Mounted Printed Circuit Assembly
Analytical Forced Convection Modeling of Plate Fin Heat Sinks
Analyzing the Natural Resting Aspects of a Component by its Centroid Solid Angle
Analyzing the Natural Resting Aspects of Plastic Parts in a Vibratory Bowl Feeder
An Analysis of Dispatching Rules in a Semiconductor Wafer Fabrication Environment
An Approximate Model for Predicting the Size and Shape of Wave-Soldered Surface-Mount Joints
An Efficient Assembly Sequencing Heuristic for Printed Circuit Board Configurations
An Experimental Study of the Self Centering of BGA Packages
An Integrated Decision-Support Environment for DFX Audit
An Integrated Methodology for Surface Mount PCB Configuration
An Integrated Rapid Modeling Environment for Managing Wafer Fabrication Facilities
An intelligent decision support environment for PCB assembly
ANISOTROPIC ADHESIVES FOR FLIP-CHIP BONDING
Anisotropic Conductive Adhesives for Chip on Glass and Other Flip Chip Applications
A NOVEL CIRCUIT FABRICATION TECHNIQUE USING OFFSET LITHOGRAPHY
Application of Dielectric Binary Mixtures in Electronic Cooling Nucleate Pool Boiling Regime
Application of ink screening models to solder paste printing in SMT assembly
Application of Polymer-Thick-Film-Technology (PTF) for Environmentally Friendly Electronic Devices
Applications of electrorheological fluid in shock absorbers
A Practical Algorithm for Cyclic Hoist Scheduling in a PCB Manufacturing Facility
A Review of PCB Design for In-Circuit Testability Guidelines and Systems
A Review on Cooling by Channel Flow Boiling for Electronic Systems
A REVIEW ON DIRECT LIQUID COOLING CHANNEL FLOW WITH SINGLE-PHASE FOR ELECTRONIC SYSTEMS
Asia's manufacturing industry gearing up for the high-value electronics market
A Simulation of Evaporating Meniscus-Driven Flow for Application to Electronics Cooling Design
A Study of Solderability and Solder Spreading for SMT Open Joints