Alimentations Modulaires pour une Architecture Distribuee
The Demise of Plastic Encapsulated Microcircuit Myths
Improving Multichip Module (MCM) Design and Reliability Using the Intelligent MCM Analyzer
The Advanced Avionics Subsystem Technology Demonstration Program
The IEEE Scalable Coherent Interface - An Approach for a Unified Avionics Network
Microchannel Heat Pipe Cooling of Modules
High Density Monolithic Packaging Technology for Digital/Microwave Avionics
Liquid Flow-Through Cooling of Electronic Modules
Advanced Standard Electronic Modules Format-E (SEM-E) Processes for Rapid Prototyping
High Performance Backplane Components for Modular Avionics
Ultra-Reliable Digital Avionics (URDA) Processor
Optical Backplane for Modular Avionics
Standard Hardware Acquisition and Reliability Program (SHARP) Advanced SEM-E Packaging
Lightweight Electronic Enclosures Using Composite Materials