A "Closed Loop'' System for the Realtime Control of Solder Paste Stencil Printing
A Computational Model for Forced Convection Cooling in Electronic Components
A Decision-Support Tool for Printed Circuit Board Assembly
Adhesive Flip Chip Bonding in a Miniaturized Spectrometer
Adhesive Flip Chip Bonding on Flexible Substrates
A Framework for the Flexible Grouping of Products for Disassembly
A fuzzy management decision support system for scenario analysis
A low-cost automated handling system for SPC evaluation of packaging processes
Alternative substrates for power electronic circuits : an experimental evaluation
A Model to Explain SMT Open Circuit Joints Associated with Adjacent Solder Bridges
Analysing the strategic implications of interconnect technologies
Analysis and Experiments of Ball Deformation for Ultra-Fine-Pitch Wire Bonding
Analysis of Design Efficiency for the Disassembly of Modular Electronic Products
Analysis of despatching policies in semiconductor post-test operations
ANALYSIS OF NATURAL RESTING ASPECTS OF COMPLEX PARTS