151–200 von 592 Ergebnissen
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    Optimization of PCB Component Placement Using Genetic Algorithms

    Jeevan, K. | Online Contents | 2002
    Verlag: World Scientific , Singapore

    Clean electricity from photovoltaics

    Archer, Mary D. / Green, Martin A. | TIBKAT | 2015
    Verlag: World Scientific Publ. , Singapore , London

    Special issue on interactive humanoid robots

    Hagita, N. / Ishiguro, H. | TIBKAT | 2008
    Verlag: World Scientific , Singapore [u.a.]

    Direct Immersion Cooled Microelectronics Heat Sinks: Effects of Test Fluid and Bonding Technique

    Bhavnani, S.H. | Online Contents | 2000
    Verlag: World Scientific , Singapore

    Analytical Forced Convection Modeling of Plate Fin Heat Sinks

    Teeristra, P. | Online Contents | 2000
    Verlag: World Scientific , Singapore

    Evaluation of Plasma Treated HASL Finish PCBs Using DCA Measurements

    Takyi, G. | Online Contents | 2000
    Verlag: World Scientific , Singapore

    Models to Estimate Printed Circuit Board Fabrication Yield During the Design Stage

    Giachetti, R. E. | Online Contents | 2000
    Verlag: World Scientific , Singapore

    Screen Printing Process Design of Experiments for Fine Line Printing of Thick Film Ceramic Substrates

    Pan, J. | Online Contents | 2000
    Verlag: World Scientific , Singapore

    Analysis and Experiments of Ball Deformation for Ultra-Fine-Pitch Wire Bonding

    Zhong, Z. | Online Contents | 2000
    Verlag: World Scientific , Singapore

    Paxametric Studies of Microchannel Conjugate Liquid Flows with Zeta Potential Effects

    Ng, E.Y.K. | Online Contents | 2000
    Verlag: World Scientific , Singapore

    Properties of Conductive Adhesives Based on Anhydride-Cured Epoxy Systems

    Lu, D. | Online Contents | 2000
    Verlag: World Scientific , Singapore

    Printed Circuit Board Manufacturing and Testing of RIMM[TM]

    Lau, J. | Online Contents | 2000
    Verlag: World Scientific , Singapore

    Special issue: Active exoskeletons

    Vukobratovic, Miomir | TIBKAT | 2007
    Verlag: World Scientific , Singapore [u.a.]

    Computer Take-back and Recycling: An Economic Analysis for Used Consumer Equipment

    Jung, L. B. | Online Contents | 1999
    Verlag: World Scientific , Singapore

    Design Considerations of High Heat Flux Heat Pipe Evaporators

    Zuo, Z.J. | Online Contents | 2000
    Verlag: World Scientific , Singapore

    Electronic Products at their End-of-Life: Options and Obstacles

    Linton, J. | Online Contents | 1999
    Verlag: World Scientific , Singapore

    A Framework for the Flexible Grouping of Products for Disassembly

    Viswanathan, S. | Online Contents | 1999
    Verlag: World Scientific , Singapore

    The "Green Design Advisor": A Tool for Design for Environment

    Feldmann, K. | Online Contents | 1999
    Verlag: World Scientific , Singapore

    Product End-of-Life Strategy Categorization Design Tool

    Rose, C. M. | Online Contents | 1999
    Verlag: World Scientific , Singapore

    A Study on Wettability and Defects Behavior of Flow-Soldered Joint Using Low Residue Flux

    Choi, M. K. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    Efficient Heuristics for Drilling Route Optimization in Printed Circuit Board Manufacturing

    Linn, R. J. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    Solder Paste Tests for the 'AART' Process

    Murthy, S. T. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    The Singapore and Malaysia Electronics Industries : D. Beane, A. Shukla and M. Pecht (Book review)

    Tilley, K. J. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    Bioevaluation of world transport networks

    Adamatsky, Andrew / Adamatzky, Andrew | TIBKAT | 2012
    Verlag: World Scientific , Hackensack, NJ [u.a.]

    Analysis of Design Efficiency for the Disassembly of Modular Electronic Products

    Veerakamolmal, P. | Online Contents | 1999
    Verlag: World Scientific , Singapore

    Special issue: Robotics for medical applications

    Ng, W. S. | TIBKAT | 2006
    Verlag: World Scientific , Singapore [u.a.]

    SMT Compatible No-Flow Underfill for Solder Bumped Flip Chip on Low-Cost Substrates

    Lau, J. H. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    Micro-Jet Printing of Polymers and Solder for Electronics Manufacturing

    Hayes, D. J. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    A Practical Algorithm for Cyclic Hoist Scheduling in a PCB Manufacturing Facility

    Mak, R. W. T. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    Vehicle Design and Results for HTS Maglev Model

    Wang, J. R. / Zhang, P. X. / Zhou, L. et al. | British Library Conference Proceedings | 1998
    Verlag: World Scientific , Singapore

    Finite Element Modeling of Heat Transfer in Chip on Tape Packages

    Yang, L. Y. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    Modeling of Acid Copper Electroplating : A Review

    Poon, G. K. K. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    An Experimental Study of the Self Centering of BGA Packages

    Huang, Y.-W. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Integrated Modeling of Electronics Assembly Systems by Colored Petri Nets

    Tam, H.-Y. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Book Review: Conductive Adhesives in Electronics Packaging (J. Liu)

    Ruf, C. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    Laser Removal of Flux Residue Before Chip Attachment to Board in a Flip Chip Assembly

    Lu, J. C. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    Special issue on new advances on formation control of autonomous vehicles

    Zhao, Shiyu / Meng, Ziyang / Zheng, Ronghao | TIBKAT | 2019
    Verlag: World Scientific , New Jersey , London , Singapore

    Introduction of super-speed rail

    Hu, Qizhou | TIBKAT | 2023
    Verlag: World Scientific , New Jersey

    Solder Paste Deposition Through High Speed Stencil Printing for a Contract Assembly Environment

    Gopalakrishnan, L. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    An Integrated Methodology for Surface Mount PCB Configuration

    Xu, Z. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    Failure Mechanisms in Semiconductor Devices : E. Ajith Amerasekera and Farid N. Najm (Book review)

    Oguibe, C. N. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    Analysis of Underfill Encapsulation Curing Deformations on Flip Chip on Boaxd (FCOB) Package Reliability

    Pang, J. H. L. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    PCB Assembly Line Setup Optimization Using Component Commonality Matrices

    Dillon, S. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    Manufacturing Analysis of Underfill Processing for Low-Cost Flip Chip Assembly

    Baldwin, D. F. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    A DECOMPOSITION METHODOLOGY FOR SCHEDULING SEMICONDUCTOR TEST OPERATIONS FOR NUMBER OF TARDY JOB MEASURES

    Yoo, Wook-Sung | Online Contents | 1997
    Verlag: World Scientific , Singapore

    REWORK OF BGA COMPONENTS

    Chung, C. W. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    The Limits of Automating Electronic Component Rework

    Geren, N. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    On Improving the Performance of Hard Disk Drive Final Assembly via Knowledge Intensive Simulation

    Zhao, Z. Y. | Online Contents | 1997
    Verlag: World Scientific , Singapore