Modeling of Material Handling Hoist Operations in a PCB Manufacturing Facility
Scheduling of Printed Wiring Board Assembly in Surface Mount Technology Lines
Special issue on interactive humanoid robots
Models to Estimate Printed Circuit Board Fabrication Yield During the Design Stage
Paxametric Studies of Microchannel Conjugate Liquid Flows with Zeta Potential Effects
Direct Immersion Cooled Microelectronics Heat Sinks: Effects of Test Fluid and Bonding Technique
Analytical Forced Convection Modeling of Plate Fin Heat Sinks
Evaluation of Plasma Treated HASL Finish PCBs Using DCA Measurements
Properties of Conductive Adhesives Based on Anhydride-Cured Epoxy Systems
Printed Circuit Board Manufacturing and Testing of RIMM[TM]
Analysis and Experiments of Ball Deformation for Ultra-Fine-Pitch Wire Bonding
Design Considerations of High Heat Flux Heat Pipe Evaporators
Computer Take-back and Recycling: An Economic Analysis for Used Consumer Equipment
Analysis of Design Efficiency for the Disassembly of Modular Electronic Products
Solder Paste Deposition Through High Speed Stencil Printing for a Contract Assembly Environment
An Integrated Methodology for Surface Mount PCB Configuration
Failure Mechanisms in Semiconductor Devices : E. Ajith Amerasekera and Farid N. Najm (Book review)
The "Green Design Advisor": A Tool for Design for Environment
Product End-of-Life Strategy Categorization Design Tool
Electronic Products at their End-of-Life: Options and Obstacles
A Framework for the Flexible Grouping of Products for Disassembly
Micro-Jet Printing of Polymers and Solder for Electronics Manufacturing
A Practical Algorithm for Cyclic Hoist Scheduling in a PCB Manufacturing Facility
Vehicle Design and Results for HTS Maglev Model
Special issue: Robotics for medical applications
PCB Assembly Line Setup Optimization Using Component Commonality Matrices
Manufacturing Analysis of Underfill Processing for Low-Cost Flip Chip Assembly
An Integrated Rapid Modeling Environment for Managing Wafer Fabrication Facilities
SMT Compatible No-Flow Underfill for Solder Bumped Flip Chip on Low-Cost Substrates
A Study on Wettability and Defects Behavior of Flow-Soldered Joint Using Low Residue Flux
Efficient Heuristics for Drilling Route Optimization in Printed Circuit Board Manufacturing
Solder Paste Tests for the 'AART' Process
The Singapore and Malaysia Electronics Industries : D. Beane, A. Shukla and M. Pecht (Book review)
Book Review: Conductive Adhesives in Electronics Packaging (J. Liu)
Laser Removal of Flux Residue Before Chip Attachment to Board in a Flip Chip Assembly
Intelligent Control of an Internal Supply Chain in the Haxd Disk Drive Industry
Integration of Environmental Factors in Pre-Layout Design Optimization for Printed Circuit Boards
Computing and optimization for DC power systems of electric transport
Analysis of Process Errors and Production Yield for Surface Mounted Printed Circuit Assembly
Bioevaluation of world transport networks
A Study of Solderability and Solder Spreading for SMT Open Joints
Hierarchical Renormalisation and Stretched Exponential Relaxations
Novel Magnetic-Field-Induced Minigap and Transport in Coupled Double QuantumWells