Paxametric Studies of Microchannel Conjugate Liquid Flows with Zeta Potential Effects
Properties of Conductive Adhesives Based on Anhydride-Cured Epoxy Systems
Printed Circuit Board Manufacturing and Testing of RIMM[TM]
Computer Take-back and Recycling: An Economic Analysis for Used Consumer Equipment
Design Considerations of High Heat Flux Heat Pipe Evaporators
Electronic Products at their End-of-Life: Options and Obstacles
A Framework for the Flexible Grouping of Products for Disassembly
The "Green Design Advisor": A Tool for Design for Environment
Product End-of-Life Strategy Categorization Design Tool
A Study on Wettability and Defects Behavior of Flow-Soldered Joint Using Low Residue Flux
Efficient Heuristics for Drilling Route Optimization in Printed Circuit Board Manufacturing
Solder Paste Tests for the 'AART' Process
The Singapore and Malaysia Electronics Industries : D. Beane, A. Shukla and M. Pecht (Book review)
Bioevaluation of world transport networks
Analysis of Design Efficiency for the Disassembly of Modular Electronic Products
Special issue: Robotics for medical applications
SMT Compatible No-Flow Underfill for Solder Bumped Flip Chip on Low-Cost Substrates
Micro-Jet Printing of Polymers and Solder for Electronics Manufacturing
A Practical Algorithm for Cyclic Hoist Scheduling in a PCB Manufacturing Facility