161–180 von 592 Ergebnissen
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    Paxametric Studies of Microchannel Conjugate Liquid Flows with Zeta Potential Effects

    Ng, E.Y.K. | Online Contents | 2000
    Verlag: World Scientific , Singapore

    Properties of Conductive Adhesives Based on Anhydride-Cured Epoxy Systems

    Lu, D. | Online Contents | 2000
    Verlag: World Scientific , Singapore

    Printed Circuit Board Manufacturing and Testing of RIMM[TM]

    Lau, J. | Online Contents | 2000
    Verlag: World Scientific , Singapore

    Special issue: Active exoskeletons

    Vukobratovic, Miomir | TIBKAT | 2007
    Verlag: World Scientific , Singapore [u.a.]

    Computer Take-back and Recycling: An Economic Analysis for Used Consumer Equipment

    Jung, L. B. | Online Contents | 1999
    Verlag: World Scientific , Singapore

    Design Considerations of High Heat Flux Heat Pipe Evaporators

    Zuo, Z.J. | Online Contents | 2000
    Verlag: World Scientific , Singapore

    Electronic Products at their End-of-Life: Options and Obstacles

    Linton, J. | Online Contents | 1999
    Verlag: World Scientific , Singapore

    A Framework for the Flexible Grouping of Products for Disassembly

    Viswanathan, S. | Online Contents | 1999
    Verlag: World Scientific , Singapore

    The "Green Design Advisor": A Tool for Design for Environment

    Feldmann, K. | Online Contents | 1999
    Verlag: World Scientific , Singapore

    Product End-of-Life Strategy Categorization Design Tool

    Rose, C. M. | Online Contents | 1999
    Verlag: World Scientific , Singapore

    A Study on Wettability and Defects Behavior of Flow-Soldered Joint Using Low Residue Flux

    Choi, M. K. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    Efficient Heuristics for Drilling Route Optimization in Printed Circuit Board Manufacturing

    Linn, R. J. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    Solder Paste Tests for the 'AART' Process

    Murthy, S. T. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    The Singapore and Malaysia Electronics Industries : D. Beane, A. Shukla and M. Pecht (Book review)

    Tilley, K. J. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    Bioevaluation of world transport networks

    Adamatsky, Andrew / Adamatzky, Andrew | TIBKAT | 2012
    Verlag: World Scientific , Hackensack, NJ [u.a.]

    Analysis of Design Efficiency for the Disassembly of Modular Electronic Products

    Veerakamolmal, P. | Online Contents | 1999
    Verlag: World Scientific , Singapore

    Special issue: Robotics for medical applications

    Ng, W. S. | TIBKAT | 2006
    Verlag: World Scientific , Singapore [u.a.]

    SMT Compatible No-Flow Underfill for Solder Bumped Flip Chip on Low-Cost Substrates

    Lau, J. H. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    Micro-Jet Printing of Polymers and Solder for Electronics Manufacturing

    Hayes, D. J. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    A Practical Algorithm for Cyclic Hoist Scheduling in a PCB Manufacturing Facility

    Mak, R. W. T. | Online Contents | 1998
    Verlag: World Scientific , Singapore