Economic Sensitivity for End of Life Planning and Processing of Personal Computers
Modeling of Material Handling Hoist Operations in a PCB Manufacturing Facility
Scheduling of Printed Wiring Board Assembly in Surface Mount Technology Lines
Optimization of PCB Component Placement Using Genetic Algorithms
Component to Multi-Track Feeder Assignment and Boaxd Sequencing in Printed Circuit Boaxd Assembly
The Impacts of Variability on Scheduling Approaches for a Printed Wiring Boaxd Assembly Operation
Neural Network Open Loop Control System for Wave Soldering
Design Considerations of High Heat Flux Heat Pipe Evaporators
Direct Immersion Cooled Microelectronics Heat Sinks: Effects of Test Fluid and Bonding Technique
Analytical Forced Convection Modeling of Plate Fin Heat Sinks
Evaluation of Plasma Treated HASL Finish PCBs Using DCA Measurements
Analysis and Experiments of Ball Deformation for Ultra-Fine-Pitch Wire Bonding
Properties of Conductive Adhesives Based on Anhydride-Cured Epoxy Systems
Printed Circuit Board Manufacturing and Testing of RIMM[TM]
Models to Estimate Printed Circuit Board Fabrication Yield During the Design Stage
Computer Take-back and Recycling: An Economic Analysis for Used Consumer Equipment
Paxametric Studies of Microchannel Conjugate Liquid Flows with Zeta Potential Effects
Electronic Products at their End-of-Life: Options and Obstacles
A Framework for the Flexible Grouping of Products for Disassembly
Analysis of Design Efficiency for the Disassembly of Modular Electronic Products
The "Green Design Advisor": A Tool for Design for Environment
Product End-of-Life Strategy Categorization Design Tool
SMT Compatible No-Flow Underfill for Solder Bumped Flip Chip on Low-Cost Substrates
Analysis of Process Errors and Production Yield for Surface Mounted Printed Circuit Assembly
A Study on Wettability and Defects Behavior of Flow-Soldered Joint Using Low Residue Flux
Efficient Heuristics for Drilling Route Optimization in Printed Circuit Board Manufacturing
Solder Paste Tests for the 'AART' Process
The Singapore and Malaysia Electronics Industries : D. Beane, A. Shukla and M. Pecht (Book review)
Finite Element Modeling of Heat Transfer in Chip on Tape Packages
Modeling of Acid Copper Electroplating : A Review
Solder Paste Deposition Through High Speed Stencil Printing for a Contract Assembly Environment
An Integrated Methodology for Surface Mount PCB Configuration
Failure Mechanisms in Semiconductor Devices : E. Ajith Amerasekera and Farid N. Najm (Book review)
Intelligent Control of an Internal Supply Chain in the Haxd Disk Drive Industry
Integration of Environmental Factors in Pre-Layout Design Optimization for Printed Circuit Boards
The Limits of Automating Electronic Component Rework
On Improving the Performance of Hard Disk Drive Final Assembly via Knowledge Intensive Simulation
Application of Polymer-Thick-Film-Technology (PTF) for Environmentally Friendly Electronic Devices
An Efficient Assembly Sequencing Heuristic for Printed Circuit Board Configurations
Thermal Management for the Robustness Improvement of Double Sided SMT Solder Reflow
Comprehensive Review of Natural and Mixed Convection Heat Transfer Models for Circuit Board Arrays
An Experimental Study of the Self Centering of BGA Packages
Integrated Modeling of Electronics Assembly Systems by Colored Petri Nets
Adhesive Flip Chip Bonding in a Miniaturized Spectrometer