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NASA GSFC EEE Parts Failure Analysis: Isolating Integrated Circuit Electrical Damage
Potential Usage of Life Test Samples for Flight
Development of a Control System for Permanent Magnet Synchronous Motor Based on LabVIEW and FPGA
A Guideline for Application of High-Density Fiber Optic Interconnects to Aerospace Platforms
Installing and Removal Tools, Connector Electrical Contact, General Specification for
Requirements for Using Robotic Hot Solder Dip to Replace the Finish on Electronic Piece Parts
Communication Transceivers Qualification Requirements - Ethernet
Los Alamos High-Energy Neutron Testing Handbook
Requirements for a COTS Assembly Management Plan
Risk Mitigation for Pb-Free Solders Used Internally to Parts
Passive RFID Tags Intended for Airborne Equipment Use
Optoelectronics for Space Flight Instruments
CatVap® – a new heating measure for exhaust aftertreatment system
Requirements for Using Robotic Hot Solder Dip to Replace the Finish on Electronic Piece Parts
Communication Transceivers Qualification Requirements - LIN
Communication Transceivers Qualification Requirements - CAN
Requirements for Plastic Encapsulated Discrete Semiconductors in Space Applications
Requirements for Plastic Encapsulated Microcircuits in Military and Avionics Applications
Physical Layer, 250 Kbps, Un-Shielded Twisted Pair (UTP)
Guide for Reliability Analysis Using the Physics-of-Failure Process
Requirements for an Electronic Components Management Plan
Automatic Character Detection System for IC Test Handler Based on Active Learning SVM
NASA Goddard Thermal Technology Overview 2017
Library of Parameterized Modules (LPM) Version 210
High Speed CAN (HSC) for Vehicle Applications at 250 kbps
Electronic Design Interchange Format Version 200
High-Speed CAN (HSC) for Vehicle Applications at 500 KBPS
High-Speed CAN (HSC) for Vehicle Applications at 500 kbps with CAN FD Data at 2 Mbps
High-Speed CAN (HSC) for Vehicle Applications at 500 kbps with CAN FD Data at 5 Mbps
Requirements for Using Robotic Hot Solder Dip to Replace the Finish on Electronic Piece Parts
NASA Electronic Parts and Packaging (NEPP) Program Plans
NASA Pathways Internship: Spring 2016