251–300 von 595 Ergebnissen
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Ihre Suche:
publisher:("World Scientific")

    Computer-Aided Design Based on a Deductive Object-Oriented Database

    Raphel, J. K. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    China Electronics Industry Forum, Shenzhen, China, 19-21 April 1995

    Tilley, K. J. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    TECHNOLOGY TRENDS IN ELECTRONICS AND PHOTONICS, THEIR MODELING AND EFFECT ON MANUFACTURING AND ASSEMBLY

    Williams, D. J. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    A NOVEL CIRCUIT FABRICATION TECHNIQUE USING OFFSET LITHOGRAPHY

    Ramsey, B. J. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Adhesive Flip Chip Bonding on Flexible Substrates

    Aschenbrenner, R. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Thermal Model of a Component Package for System Level Applications

    Teng, S. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    THERMAL DISSIPATION CHARACTERISTICS OF A TAPE AUTOMATED BONDING ELECTRONIC PACKAGE

    Yang, L. Y. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    A REVIEW ON DIRECT LIQUID COOLING CHANNEL FLOW WITH SINGLE-PHASE FOR ELECTRONIC SYSTEMS

    Xu, G. P. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    A Review on Cooling by Channel Flow Boiling for Electronic Systems

    Xu, G. P. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    A low-cost automated handling system for SPC evaluation of packaging processes

    Yeo, S. H. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Joining of displays using thermosetting anisotropically conductive adhesives

    Liu, Johan | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Development goals and present status of 3M's adhesive interconnection technology

    Hogerton, Peter B. | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Properties of anisotropic conductive adhesive pastes for fine-pitch surface mount technology

    Goward, John M. | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Debonding of adhesively joined electronic circuits for recycling

    Hartwig, A. | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Proposal for Monitoring Sand Dunes Movement by Remote Sensing

    Hassan, H. M. / International Centre for Theoretical Physics / University of Khartoum | British Library Conference Proceedings | 1989
    Verlag: World Scientific , Singapore

    Pan Asian Electronic Business '94

    Souza, R. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Computer simulation of solder paste flow, part II : Flow out of a stencil aperture

    Mannan, S. H. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Application of ink screening models to solder paste printing in SMT assembly

    Mannan, S. H. | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Wind Experiments

    Moeller, J. T. / International Centre for Theoretical Physics / University of Khartoum | British Library Conference Proceedings | 1989
    Verlag: World Scientific , Singapore

    A Computational Model for Forced Convection Cooling in Electronic Components

    Olivos, T. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    A Review of PCB Design for In-Circuit Testability Guidelines and Systems

    Gallagher, C. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    Electric Properties of Connections by Anisotropic Conductive Film

    Shiozawa, N. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    CPS: a productivity tool for component placement in multi-head concurrent operation PCBA machines

    Souza, R. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Sub-pixel resolution for low-cost SMT component placement inspection systems

    Mahon, James | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Competing in the electronics industry : benchmarking world-class performers

    Roth, Aleda V. | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Black TiO2 nanomaterials for energy applications

    Chen, Xiaobo / Cui, Yi | TIBKAT | 2017
    Verlag: World Scientific , New Jersey , London , Singapore

    An intelligent decision support environment for PCB assembly

    Soon, Chong Chin | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Implementation of a decision support system for scheduling semiconductor test operations

    Lee, Chung-Yee | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Wind Tunnel Modeling of Sand Transport Physics and Control

    Iversen, J. D. / International Centre for Theoretical Physics / University of Khartoum | British Library Conference Proceedings | 1989
    Verlag: World Scientific , Singapore

    A Physically Based Wind Erosion Estimation Method

    Gillette, D. A. / International Centre for Theoretical Physics / University of Khartoum | British Library Conference Proceedings | 1989
    Verlag: World Scientific , Singapore

    The Performance of Vibrating Squeegee in the Stencil Printing of Solder Pastes

    Ekere, N. N. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    ENVIRONMENTAL CONCERNS AND RECYCLING/DISASSEMBLY EFFORTS IN THE ELECTRONICS INDUSTRY

    Moyer, Leanne K. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Reliability Testing on Flip Chip Joining with Isotropically-Conductive Adhesives

    Pennanen, V. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    IC MANUFACTURING IN THE 1990s

    Knepper, Jonathan | Online Contents | 1995
    Verlag: World Scientific , Singapore

    CONDUCTION AND MICROSTRUCTURE DEVELOPMENT IN Ag-FILLED EPOXIES

    Klosterman, Don | Online Contents | 1995
    Verlag: World Scientific , Singapore

    A "Closed Loop'' System for the Realtime Control of Solder Paste Stencil Printing

    Chung, C.-W. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    A Decision-Support Tool for Printed Circuit Board Assembly

    Ong, N. S. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    An Analysis of Dispatching Rules in a Semiconductor Wafer Fabrication Environment

    McCutchen, T. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    IN SITU STUDY OF SOLDER PASTE BEHAVIOR DURING REFLOW USING THE HOT-STAGE ENVIRONMENTAL SCANNING ELECTRON MICROSCOPE

    Natishan, M. E. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Effects of Gap Height on Conduction within Anisotropic Conducting Adhesive Assemblies

    Mannan, S. H. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    A fuzzy management decision support system for scenario analysis

    Khoo, L. P. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    What are the design and manufacturing couplings for electronics products?

    Williams, D. J. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Die-bonding of large-area naked chips

    Rörgren, Roger | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Portable communications : trends in systems and component technology

    Gross, D. | Online Contents | 1994
    Verlag: World Scientific , Singapore