Computer-Aided Design Based on a Deductive Object-Oriented Database
China Electronics Industry Forum, Shenzhen, China, 19-21 April 1995
A NOVEL CIRCUIT FABRICATION TECHNIQUE USING OFFSET LITHOGRAPHY
Adhesive Flip Chip Bonding on Flexible Substrates
Thermal Model of a Component Package for System Level Applications
THERMAL DISSIPATION CHARACTERISTICS OF A TAPE AUTOMATED BONDING ELECTRONIC PACKAGE
A REVIEW ON DIRECT LIQUID COOLING CHANNEL FLOW WITH SINGLE-PHASE FOR ELECTRONIC SYSTEMS
A Review on Cooling by Channel Flow Boiling for Electronic Systems
A low-cost automated handling system for SPC evaluation of packaging processes
Joining of displays using thermosetting anisotropically conductive adhesives
Development goals and present status of 3M's adhesive interconnection technology
Properties of anisotropic conductive adhesive pastes for fine-pitch surface mount technology
Debonding of adhesively joined electronic circuits for recycling
Proposal for Monitoring Sand Dunes Movement by Remote Sensing
Computer simulation of solder paste flow, part II : Flow out of a stencil aperture
Application of ink screening models to solder paste printing in SMT assembly
A Computational Model for Forced Convection Cooling in Electronic Components
A Review of PCB Design for In-Circuit Testability Guidelines and Systems
Electric Properties of Connections by Anisotropic Conductive Film
CPS: a productivity tool for component placement in multi-head concurrent operation PCBA machines
Sub-pixel resolution for low-cost SMT component placement inspection systems
Competing in the electronics industry : benchmarking world-class performers
Black TiO2 nanomaterials for energy applications
An intelligent decision support environment for PCB assembly
Implementation of a decision support system for scheduling semiconductor test operations
Wind Tunnel Modeling of Sand Transport Physics and Control
A Physically Based Wind Erosion Estimation Method
The Performance of Vibrating Squeegee in the Stencil Printing of Solder Pastes
ENVIRONMENTAL CONCERNS AND RECYCLING/DISASSEMBLY EFFORTS IN THE ELECTRONICS INDUSTRY
Reliability Testing on Flip Chip Joining with Isotropically-Conductive Adhesives
CONDUCTION AND MICROSTRUCTURE DEVELOPMENT IN Ag-FILLED EPOXIES
A "Closed Loop'' System for the Realtime Control of Solder Paste Stencil Printing
A Decision-Support Tool for Printed Circuit Board Assembly
An Analysis of Dispatching Rules in a Semiconductor Wafer Fabrication Environment
Effects of Gap Height on Conduction within Anisotropic Conducting Adhesive Assemblies
A fuzzy management decision support system for scenario analysis
What are the design and manufacturing couplings for electronics products?
Portable communications : trends in systems and component technology