Reliability Assessment of Multichip Module Technologies via the Tri-Service/NASA RELTECH Program
Boitiers Composites pour Equipements Electroniques Aeroportes: Une Etude Technologique et CEM
Assuring Known Good Die (KGD) for Reliable, Cost Effective MCMs
MCMs for Avionics - Technology Selection and Intermodule Interconnection
The Impact of Advanced Packaging Technology on Modular Avionics Architectures
A Practical Experience of ADA for Developing Embedded Software
Coprocessor Support for Real-Time ADA
Electromagnetic Compatibility Effects of Advanced Packaging Configurations