41–60 von 179 Ergebnissen
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    Integrated Modeling of Electronics Assembly Systems by Colored Petri Nets

    Tam, H.-Y. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Solder Paste Deposition Through High Speed Stencil Printing for a Contract Assembly Environment

    Gopalakrishnan, L. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    An Integrated Methodology for Surface Mount PCB Configuration

    Xu, Z. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    Failure Mechanisms in Semiconductor Devices : E. Ajith Amerasekera and Farid N. Najm (Book review)

    Oguibe, C. N. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    A DECOMPOSITION METHODOLOGY FOR SCHEDULING SEMICONDUCTOR TEST OPERATIONS FOR NUMBER OF TARDY JOB MEASURES

    Yoo, Wook-Sung | Online Contents | 1997
    Verlag: World Scientific , Singapore

    REWORK OF BGA COMPONENTS

    Chung, C. W. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    The Limits of Automating Electronic Component Rework

    Geren, N. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    On Improving the Performance of Hard Disk Drive Final Assembly via Knowledge Intensive Simulation

    Zhao, Z. Y. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    TECHNOLOGY TRENDS IN ELECTRONICS AND PHOTONICS, THEIR MODELING AND EFFECT ON MANUFACTURING AND ASSEMBLY

    Williams, D. J. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    A NOVEL CIRCUIT FABRICATION TECHNIQUE USING OFFSET LITHOGRAPHY

    Ramsey, B. J. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Adhesive Flip Chip Bonding on Flexible Substrates

    Aschenbrenner, R. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Thermal Model of a Component Package for System Level Applications

    Teng, S. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Intelligent Control of an Internal Supply Chain in the Haxd Disk Drive Industry

    Zhao, Z. Y. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    Integration of Environmental Factors in Pre-Layout Design Optimization for Printed Circuit Boards

    Siddhaye, S. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    Analysis of Process Errors and Production Yield for Surface Mounted Printed Circuit Assembly

    Linn, R. J. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    IN SITU STUDY OF SOLDER PASTE BEHAVIOR DURING REFLOW USING THE HOT-STAGE ENVIRONMENTAL SCANNING ELECTRON MICROSCOPE

    Natishan, M. E. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Effects of Gap Height on Conduction within Anisotropic Conducting Adhesive Assemblies

    Mannan, S. H. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    ENVIRONMENTAL CONCERNS AND RECYCLING/DISASSEMBLY EFFORTS IN THE ELECTRONICS INDUSTRY

    Moyer, Leanne K. | Online Contents | 1997
    Verlag: World Scientific , Singapore