1–9 von 9 Ergebnissen
|

    Insulation reliability issues in high frequency/transient environments of next generation high power electronics

    Sarjeant, W.J. / Treanor, M. / Zirnheld, J. | Tema Archiv | 1996
    Verlag: IEEE Service Center , Piscataway

    Plasma spray forming as a novel production method for thermoelectric materials

    Schilz, J. / Riffel, M. / Mathesius, R. et al. | Tema Archiv | 1996
    Verlag: IEEE Service Center , Piscataway

    A novel ultrasonic probe for the evaluation of corrosion in aluminum aircraft panels

    Jagasivamani, V. / Johnston, P.H. | Tema Archiv | 1993
    Verlag: IEEE Service Center , Piscataway

    Millimeter-wave characterization of several substrate materials for automotive applications

    Sturdivant, R. | Tema Archiv | 1995
    Verlag: IEEE Service Center , Piscataway

    Dense semiconductor-insulator nanocomposites for navy thermoelectric applications

    Demske, D. | Tema Archiv | 1996
    Verlag: IEEE Service Center , Piscataway

    Real-time through transmission inspection of aircraft composites using air-coupled ultrasonic arrays

    Kelly, S.P. / Hayward, G. | Tema Archiv | 1995
    Verlag: IEEE Service Center , Piscataway

    Feasibitity of using Lamb waves vor corrosion detection in layered aluminum aircraft structures

    Sun, K.J. / Kishoni, D. / Johnston, P.H. | Tema Archiv | 1993
    Verlag: IEEE Service Center , Piscataway

    Thermal cycle performance of Ag-bearing thick film conductors for automotive applications

    Yamamoto, K. / Uchida, S. / Kojo, H. et al. | Tema Archiv | 1992
    Verlag: IEEE Service Center , Piscataway

    SiC as dielectric material for high temperature applications

    Tsao, B.H. / Ramalingam, M.L. / Carr, S.F. | Tema Archiv | 1994
    Verlag: IEEE Service Center , Piscataway