Reports from Participating Countries: Canada
Reports from Participating Countries: States Air Force
Liquid Flow-Through Cooling of Electronic Modules
Advanced Standard Electronic Modules Format-E (SEM-E) Processes for Rapid Prototyping
Reports from Participating Countries: Netherlands
Reports from Participating Countries: United Kingdom
Reports from Participating Countries: Sweden
Reports from Participating Countries: France
The IEEE Scalable Coherent Interface - An Approach for a Unified Avionics Network
Microchannel Heat Pipe Cooling of Modules
High Density Monolithic Packaging Technology for Digital/Microwave Avionics
Common ADA Missile Packages (CAMP)
Alimentations Modulaires pour une Architecture Distribuee
Lightweight Electronic Enclosures Using Composite Materials
The Design and Manufacturing Development of an Active Silicon Substrate MCM
Reliability Assessment of Multichip Module Technologies via the Tri-Service/NASA RELTECH Program
Software Design Considerations for an Airborne Command and Control Workstation
Aerospace Software Engineering Works