61–80 von 179 Ergebnissen
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    A Review on Cooling by Channel Flow Boiling for Electronic Systems

    Xu, G. P. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    IN SITU STUDY OF SOLDER PASTE BEHAVIOR DURING REFLOW USING THE HOT-STAGE ENVIRONMENTAL SCANNING ELECTRON MICROSCOPE

    Natishan, M. E. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Effects of Gap Height on Conduction within Anisotropic Conducting Adhesive Assemblies

    Mannan, S. H. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Adhesive Flip Chip Bonding in a Miniaturized Spectrometer

    Rusanen, O. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Application of Dielectric Binary Mixtures in Electronic Cooling Nucleate Pool Boiling Regime

    Lee, T.-Y. T. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    ENVIRONMENTAL CONCERNS AND RECYCLING/DISASSEMBLY EFFORTS IN THE ELECTRONICS INDUSTRY

    Moyer, Leanne K. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Reliability Testing on Flip Chip Joining with Isotropically-Conductive Adhesives

    Pennanen, V. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Hygrothermal Reliability Evaluation of Plastic IC Packages with Computer-Aided Engineering Tools

    Kuo, A.-Y. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Analyzing the Natural Resting Aspects of Plastic Parts in a Vibratory Bowl Feeder

    Ngoi, B. K. A. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Micro- Application of Non-Filled Adhesives for Precision Assembly in Microsystems Manufacturing

    Bauer, A. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    A Decision-Support Tool for Printed Circuit Board Assembly

    Ong, N. S. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    An Analysis of Dispatching Rules in a Semiconductor Wafer Fabrication Environment

    McCutchen, T. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    Parameter Interactions in Stencil Printing of Solder Paste

    Haslehurst, L. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    Thermal analysis of IC packages and printed circuit boards

    Tay, A. A. O. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Wire bond parameter optimization study

    Viloria, E. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Solder paste for tomorrow's electronics manufacturing technology

    Lee, Ning-Cheng | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Analysis of despatching policies in semiconductor post-test operations

    Azrak, Marijean | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Design and development of a generic PCBA line simulator

    Souza, Robert | Online Contents | 1993
    Verlag: World Scientific , Singapore

    SMT Feeder Slot Assignment for Predetermined Component Placement Paths

    Moyer, L. K. | Online Contents | 1996
    Verlag: World Scientific , Singapore