A Review on Cooling by Channel Flow Boiling for Electronic Systems
Effects of Gap Height on Conduction within Anisotropic Conducting Adhesive Assemblies
Adhesive Flip Chip Bonding in a Miniaturized Spectrometer
Application of Dielectric Binary Mixtures in Electronic Cooling Nucleate Pool Boiling Regime
ENVIRONMENTAL CONCERNS AND RECYCLING/DISASSEMBLY EFFORTS IN THE ELECTRONICS INDUSTRY
Reliability Testing on Flip Chip Joining with Isotropically-Conductive Adhesives
Hygrothermal Reliability Evaluation of Plastic IC Packages with Computer-Aided Engineering Tools
Analyzing the Natural Resting Aspects of Plastic Parts in a Vibratory Bowl Feeder
Micro- Application of Non-Filled Adhesives for Precision Assembly in Microsystems Manufacturing
A Decision-Support Tool for Printed Circuit Board Assembly
An Analysis of Dispatching Rules in a Semiconductor Wafer Fabrication Environment
Parameter Interactions in Stencil Printing of Solder Paste
Thermal analysis of IC packages and printed circuit boards
Wire bond parameter optimization study
Solder paste for tomorrow's electronics manufacturing technology
Analysis of despatching policies in semiconductor post-test operations
Design and development of a generic PCBA line simulator
SMT Feeder Slot Assignment for Predetermined Component Placement Paths