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Rapid Prototyping of Photonic Integrated Circuits
Optoelectronic Integration of Thin Film Devices for Photonic Interconnect
A Three-Dimensional Optical Interconnection Network for Fine-Grain Parallel Architectures
Optical and Package Design Issues for Chip-to-Chip Free-Space Optical Interconnections
Fabrication Issues for Free-Space Optics at the Board Packaging Level
Direction of Optoelectronics Research at ARPA
U.S.-Japan Joint Optoelectronics Project
Demonstration of GaAs LEDs on SI Chips Using Epitaxial Liftoff
Packaging of Liquid Crystal on Silicon Modulators Using Solder
Expectations from Optoelectronic Technologies
Integrated Optical Heads for Optical Data Storage
Direct Dispensing of Polymer Waveguides on Silicon Substrates
Dispensed Dual-Polymer Waveguides on Silicon V-Grooves
Consortium for Optical and Optoelectronic Technologies for Computing
Alignment Considerations in the Package Design of Optical Interconnections
Thin Film Resonant Cavity Enhanced Photodetectors
30% External Quantum Efficiency From Surface Textured, Thin-Film Light-Emitting-Diode Arrays
20-channel Optoelectronic Receiver for Free-Space Optical Interconnection
Solder Bonded Optoelectronic Transceiver Components
GaAs 850nm Surface-normal Modulators Solder-bonded to Silicon
Prototype Optically Interconnected Multichip Module with Holographic Optical Interconnects
Results of OEMCM Packaging Efforts at LLNL
Diamond windows for IR applications in adverse environments
Channel and Terminal Description of the ACTS Mobile Terminal
Channel and Terminal Description of the Acts Mobile Terminal
Methodology Investigation, Final Report of Global Positioning System Integration (GPS)
Methodology Investigation, Final Report of Global Positioning System Integration (GPS)
Active pixel sensors: Are CCD's dinosaurs?
Telemetry Ground System Development Via the Component Approach
CORPS Surface-to-Air Missile (SAM) System Manpower, Personnel and Training Analysis
NASA Space Engineering Research Center for VLSI System Design
An in-vehicle communications LSI set for automotive electronic control systems
In-vehicle information systems and semiconductor devices they employ
The battery builtin frame - a new frame structure for an EV
Computerunterstütztes Telefonieren
LEDs gewinnen neue Märkte. LED contra Glühbirne im Kfz
Determination of lines of constant phase in the near-field of a metallic cube and an airplane
Millimeter radar: current assessment, future directions
High performance backlights - the enabling technology for high-density LCDs
Integrated helmet system with image intensifier tubes
Electronic Availability of Microgravity Experiments Safety and Integration Requirements Documents
Effects of seawater absorption on fatigue crack development in carbon/epoxy EDT specimens
Non-Explosive Actuation for the Orbcomm (TM) Satellite