Synonyme wurden verwendet für: encapsulation
Suche ohne Synonyme: keywords:(encapsulation)

201–216 von 216 Ergebnissen
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    Automotive package size driven by market demand

    Mellinger, E.M. / Yuska, P. | Tema Archiv | 1990
    Schlagwörter: KAPSELUNG

    Comparison of mechanical reliability of three underfill materials for flip chip bumps on high Tg PCB for automotive applications

    Fabbri, G. / Sartori, C. / Scarano, G. | Tema Archiv | 2001
    Schlagwörter: Chip-on-board-Kapselung

    Packaging military and commercial electronics

    Markstein, H.W. | Tema Archiv | 1987
    Schlagwörter: KAPSELUNG

    Alvin-120 VDC/28 VDC electrical system

    Hosom, D.S. / Forrester, N.C. / Walden, B.B. | Tema Archiv | 1987
    Schlagwörter: KAPSELUNG

    Enabling technologies for integrated system-on-a-package for the next generation aerospace applications

    Young, J.J. / Malshe, A.P. / Brown, W.D. et al. | Tema Archiv | 2002
    Schlagwörter: Wärmehaushalt (Kapselung)

    Direct glassing of silicon space solar cells: approach and manufacturing experiences

    Koch, J.W. / White, P.A. | Tema Archiv | 1990
    Schlagwörter: KAPSELUNG

    Thermal management of military fighter aircraft electro-optics pod: an invited paper

    Price, D.C. | Tema Archiv | 2003
    Schlagwörter: Wärmehaushalt (Kapselung)

    3-layered 3D flex based MCM: electrical characterization and reliability issues

    Morrison, W.B. / Railkar, T.A. / Malshe, A.P. et al. | Tema Archiv | 1999
    Schlagwörter: Wärmehaushalt (Kapselung)

    NASA Lewis advanced individual pressure vessel (IPV) nickel/hydrogen technology

    Smithrick, J.J. / Britton, D.L. | Tema Archiv | 1994
    Schlagwörter: druckfeste Kapselung

    A tunable over controlled oscillator for space application based on a thick film hermetic hybrid

    Revel, F. / Monichino, M. | Tema Archiv | 1990
    Schlagwörter: KAPSELUNG

    Results of assembly and reliability investigation of an MCM-L for an automotive application: electronic control unit

    Joly, J. / Lambert, D. / Ansorge, F. et al. | Tema Archiv | 1998
    Schlagwörter: Verkapseln , Chip-on-board-Kapselung

    An electrostatic accelerator for ultrahypervelocity microprojectiles

    Conte, D. / Turchi, P.J. / Bird, G. et al. | Tema Archiv | 1991
    Schlagwörter: KAPSELUNG

    Microwave multichip modules using low cost microwave chip on flex packaging technology

    McNulty, M. / Schnell, J. / Nixon, D. | Tema Archiv | 1998
    Schlagwörter: Verkapseln

    Hermetic-equivalent packaging of data accumulator MCM-L modules for general aviation avionics applications

    Conway, C.M. / Hagge, J.K. | Tema Archiv | 1998
    Schlagwörter: Verkapseln

    Multichip modules for today's VLSI circuits

    Moravec, T.J. / Jensen, R.J. / Coogan, S.A. et al. | Tema Archiv | 1990
    Schlagwörter: KAPSELUNG