Zuverlaessigkeit am Beispiel der Flugzeugelektronik
Wirebonding on multilayer circuits for automotive applications using robust thick-film conductors
Trends in failure survival techniques for avionic systems
Thermal characterisation and heat transfer analysis of a wire bond chip-on-board package
The past, present and future of EEE components for space application; COTS-the next generation
The Influence of Knowledge Accumulation on Buyer-Supplier Codevelopment Projects
SRAM based re-programmable FPGA for space applications
Soldered flip chip IC's in automotive applications
Scaling of temperature sensors for smart power MOSFETs
Reliable power electronics for automotive applications
Reliability of MEMS - a methodical approach
Random vibration screening of an airborne digital computer
R and M 2000 and the Air Force acquisition process
Qualification of a spin apply, photodefinable polymer for packaging of automotive circuits
Programmable Aging Sensor for Automotive Safety-Critical Applications