Synonyme wurden verwendet für: encapsulation
Suche ohne Synonyme: keywords:(encapsulation)

121–140 von 166 Ergebnissen
|

    Model for BGA and CSP reliability in automotive underhood applications

    Lall, P. / Islam, N. / Suhling, J. | Tema Archiv | 2003
    Schlagwörter: Chip-Größen-Kapselung

    Thermal management of military fighter aircraft electro-optics pod: an invited paper

    Price, D.C. | Tema Archiv | 2003
    Schlagwörter: Wärmehaushalt (Kapselung)

    An improved, linear homopolar, electromagnetic launcher: STAR

    Nunnally, W.C. / Thompson, J.E. / Engel, T.G. et al. | Tema Archiv | 2004
    Schlagwörter: Wärmehaushalt (Kapselung)

    Thermal characterization of a mercury arc lamp for a projection display system

    Bush, B. / Li, Shu / Kelley, D. | Tema Archiv | 2004
    Schlagwörter: Wärmehaushalt (Kapselung)

    New method for electrothermal simulations: HDTMOS in automotive applications

    Tounsi, P. / Dorkel, J.M. / Dupuy, P. et al. | Tema Archiv | 2004
    Schlagwörter: Wärmehaushalt (Kapselung)

    The changing automotive environment: high-temperature electronics

    Johnson, R.W. / Evans, J.L. / Jacobsen, P. et al. | Tema Archiv | 2004
    Schlagwörter: Wärmehaushalt (Kapselung)

    Stackable In-Line Underwater Missile Launch System for a Modular Payload Bay

    M. T. Ansay | NTIS | 2004
    Schlagwörter: Encapsulation

    Thermal management of Li-ion battery with phase change material for electric scooters: experimental validation

    Khateeb, S.A. / Amiruddin, S. / Farid, M. et al. | Tema Archiv | 2005
    Schlagwörter: Wärmehaushalt (Kapselung)

    Reliability potential of epoxy based encapsulants for automotive applications

    Braun, T. / Becker, K.F. / Koch, M. et al. | Tema Archiv | 2005
    Schlagwörter: Verkapseln

    Packaging considerations of an integrated inverter module (IIM) for hybrid vehicles

    Beckedahl, P. / Tursky, W. / Scheuermann, U. | Tema Archiv | 2005
    Schlagwörter: Verkapseln

    Metal-enclosed, air-insulated traction switchgear - developments and applications

    Lönard, Detlef / Northe, Jens | Tema Archiv | 2006
    Schlagwörter: Kapselung

    Hydrogen for a global application to road transport

    Rinaldi, P. / Veca, G.M. | Tema Archiv | 2007
    Schlagwörter: Einkapselung

    Test method for availability of holes in height - temperature barrier on cementation process

    Valentin Tcenev, I. / Fillipov, F. | Tema Archiv | 2007
    Schlagwörter: Wärmehaushalt (Kapselung)

    A study of chip top delamination in plastic encapsulated packages under temperature loading

    Kravchenko, G. / Bohm, C. | Tema Archiv | 2007
    Schlagwörter: Verkapseln

    High efficiency, high reliability 2 kW inverter for aeronautical application

    Vieillard, S. / Meuret, R. | Tema Archiv | 2007
    Schlagwörter: Wärmehaushalt (Kapselung)

    MEMS package in a harsh environment for aeronautic applications

    Friedberger, Alois / Gradolph, Christian / Klettner, Florian et al. | Tema Archiv | 2008
    Schlagwörter: Verkapseln

    Novel component packaging for high current applications using power semiconductor devices

    Weigeber, Volker / Hayes, Montry B. / Campbell, Robert J. et al. | Tema Archiv | 2009
    Schlagwörter: verbesserte Einkapselung

    Design limitations of powertrain electronics - automotive EMC challenges

    Kuvedu-Libla, J.R.K. | Tema Archiv | 2009
    Schlagwörter: Wärmehaushalt (Kapselung)

    New method to determine the range of DVB-H networks and the influence of MPE-FEC rate and modulation scheme

    Plets, David / Joseph, Wout / Verloock, Leen et al. | Tema Archiv | 2009
    Schlagwörter: MPE (multiprotocol encapsulation)

    A Novel Technology for Thermal Control for ISP module for Space Applications

    Monti, Riccardo / Barboni, Renato / Gasbarri, Paolo et al. | Tema Archiv | 2010
    Schlagwörter: Wärmehaushalt (Kapselung)