Printed Circuit Board Manufacturing and Testing of RIMM[TM]
Models to Estimate Printed Circuit Board Fabrication Yield During the Design Stage
Paxametric Studies of Microchannel Conjugate Liquid Flows with Zeta Potential Effects
Analysis and Experiments of Ball Deformation for Ultra-Fine-Pitch Wire Bonding
Computing and optimization for DC power systems of electric transport
Computer Take-back and Recycling: An Economic Analysis for Used Consumer Equipment
Analysis of Design Efficiency for the Disassembly of Modular Electronic Products
Toward sustainable and economic smart mobility : shaping the future of smart cities
Toward sustainable and economic smart mobility : shaping the future of smart cities
Design Considerations of High Heat Flux Heat Pipe Evaporators
Special issue: Robotics for medical applications
A Study on Wettability and Defects Behavior of Flow-Soldered Joint Using Low Residue Flux
Efficient Heuristics for Drilling Route Optimization in Printed Circuit Board Manufacturing
Solder Paste Tests for the 'AART' Process
The Singapore and Malaysia Electronics Industries : D. Beane, A. Shukla and M. Pecht (Book review)
Solder Paste Deposition Through High Speed Stencil Printing for a Contract Assembly Environment
An Integrated Methodology for Surface Mount PCB Configuration
Failure Mechanisms in Semiconductor Devices : E. Ajith Amerasekera and Farid N. Najm (Book review)
Bioevaluation of world transport networks
The "Green Design Advisor": A Tool for Design for Environment
Product End-of-Life Strategy Categorization Design Tool
Electronic Products at their End-of-Life: Options and Obstacles
A Framework for the Flexible Grouping of Products for Disassembly
SMT Compatible No-Flow Underfill for Solder Bumped Flip Chip on Low-Cost Substrates
Intelligent Control of an Internal Supply Chain in the Haxd Disk Drive Industry
Integration of Environmental Factors in Pre-Layout Design Optimization for Printed Circuit Boards
An Experimental Study of the Self Centering of BGA Packages
Integrated Modeling of Electronics Assembly Systems by Colored Petri Nets
Special issue on new advances on formation control of autonomous vehicles
An Integrated Rapid Modeling Environment for Managing Wafer Fabrication Facilities
Micro-Jet Printing of Polymers and Solder for Electronics Manufacturing
A Practical Algorithm for Cyclic Hoist Scheduling in a PCB Manufacturing Facility
Vehicle Design and Results for HTS Maglev Model
PCB Assembly Line Setup Optimization Using Component Commonality Matrices
Manufacturing Analysis of Underfill Processing for Low-Cost Flip Chip Assembly
A continuously variable ER damper with energy generation
The Limits of Automating Electronic Component Rework
On Improving the Performance of Hard Disk Drive Final Assembly via Knowledge Intensive Simulation
Finite Element Modeling of Heat Transfer in Chip on Tape Packages
Modeling of Acid Copper Electroplating : A Review
Book Review: Conductive Adhesives in Electronics Packaging (J. Liu)
Laser Removal of Flux Residue Before Chip Attachment to Board in a Flip Chip Assembly
Micro- Application of Non-Filled Adhesives for Precision Assembly in Microsystems Manufacturing