Yield Estimation Through Component Placement Accuracy Evaluation in Surface Mount PWB Assembly
Workshop on Traffic and Granular Flow : HLRZ, Forschungszentrum Jülich, Germany October 9-11, 1995
Workshop on Traffic and Granular Flow : HLRZ, Forschungszentrum Jülich, Germany October 9-11, 1995
Wire bond parameter optimization study
Wind Tunnel Modeling of Sand Transport Physics and Control
When it comes to the crunch : the mechanics of car collisons
What are the design and manufacturing couplings for electronics products?
Wave propagation for train-induced vibrations : a finite/infinte element approach
Wave propagation for train-induced vibrations : a finite/infinte element approach
Wave Instability in Liquid-Fluidized Beds
Vortex Drift: A Historical Survey
Visual servoing : real-time control of robot manipulators based on visual sensory feedback
Vehicle Design and Results for HTS Maglev Model
Vehicle-bridge interaction dynamics: with applications to high-speed railways
Unsteady Aerodynamics of Vortical Flows: Early and Recent Developments
Two Dual Representations of Mathematical Morphology Based on the Parallel Normal Transport Property
Treatment of Random Variability in Traffic Modelling
Transients in Homogeneous Granular Pipe Flow
Trajectory Correction Manoeuvres in the Transfer to Libration Point Orbits
Traffic Simulations Using Cellular Automata: Comparison With Reality
Traffic Modelling by Means of Physical Concepts
Tracking with Adaptive Adjacency Graphs
Toward sustainable and economic smart mobility : shaping the future of smart cities
Toward sustainable and economic smart mobility : shaping the future of smart cities
Tolerance analysis and synthesis across assemblies : state-of-the-art review
Thin Sheet Springback Optimal Assessment
The use of electronic speckle pattern interferometry in electronics manufacturing process modelling
The Solderability Evaluation of Surface Mount Components Through the Use of Wetting Balance Analysis
The SOHO Mission L~1 Halo Orbit Recovery from the Attitude Control Anomalies of 1998
The Singapore and Malaysia Electronics Industries : D. Beane, A. Shukla and M. Pecht (Book review)
The significance of desoldering and resoldering methods in robotic automated rework
Thermal Model of a Component Package for System Level Applications
Thermal Management for the Robustness Improvement of Double Sided SMT Solder Reflow
THERMAL DISSIPATION CHARACTERISTICS OF A TAPE AUTOMATED BONDING ELECTRONIC PACKAGE
Thermal analysis of IC packages and printed circuit boards
The Performance of Vibrating Squeegee in the Stencil Printing of Solder Pastes
Theory of Two-Phonon Processes in Atom-Surface Collision: Application to He + Pt(111) System
Theory of satellite fragmentation in orbit
The Origin and Prevention of Post Reflow Defects in Surface Mount Assembly
The Microscopic Modelling of Traffic Flow: Weaknesses and Potential Developments
The Limits of Automating Electronic Component Rework
The Investigation of Stationary Points in Central Configuration Dynamics
The Impacts of Variability on Scheduling Approaches for a Printed Wiring Boaxd Assembly Operation
The "Green Design Advisor": A Tool for Design for Environment
The Explosive Ordnance Disposal Robot: CEO Mission EOD
The Estimation of Curves to Subpixel Accuracy