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Kraftfahrzeugelektronik
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Packaging of micro devices for automotive applications - techniques and examples
Micro-opto-electro-mechanical-systems (MOEMS) in automotive applications
Micro-mechatronics in automotive applications
Modellierung und Anwendung von Silizium-Mikrofonsystemen
Microsystems packaging for automotive applications
Integration of micro-mechatronics in automotive applications
Reliability potential of epoxy based encapsulants for automotive applications
3D integration of image sensor SiP using TSV silicon interposer
New principle for front light systems in automotive applications
Flip chip technology for multi chip modules
High temperature potential of flip chip assemblies for automotive applications
Multichip modules for automotive applications
Accelerated testing of flip chip packages under dynamic load
Alternative solders for flip chip applications in the automotive environment