Today, packaging relies either on using well established package types like TO, butterfly or ceramic packages, or - applicable only for very high volume products - dedicated package developments. Wafer level packages, as being developed in the microelectronic industry, are currently finding their niche and potential wide spread use also for the packaging of MEMS devices. This can incur substantial cost savings in the future, as seen in the microelectronics industry as well. Conventionally, packaging of the devices is a separate process step that provides a structure which can be handled during the subsequent manufacturing sequence and provides the functionality required. However, for high volume products and for optimised performance, an entire (sub-) system may be designed from the beginning to provide highest cost efficiency, highest function density and optimum performance. Such devices are 'functional packages' which not only encase the device function but add their own functionality to maximize the overall performance. So far, functional packages find their applications in the consumer industry (e.g. ink jet cartridges) and medical industry (blood sensors), e.g. in throw-away products. However, with 'platform concepts' 're-use of technology' over the various automotive models, the automotive industry can take advantage of the concepts developed for these ultra-low cost products.


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    Titel :

    Packaging of micro devices for automotive applications - techniques and examples


    Weitere Titelangaben:

    Packungsdichte von fahrzeugspezifischen, mikrotechnischen Sensoren/Aktoren - Technologie und Beispiele


    Beteiligte:
    Jung, E. (Autor:in) / Grosser, V. (Autor:in) / Becker, K.F. (Autor:in) / Koch, M. (Autor:in)


    Erscheinungsdatum :

    2003


    Format / Umfang :

    9 Seiten, 7 Bilder, 1 Tabelle, 9 Quellen



    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




    Packaging of Micro Devices for Automotive Applications

    Jung, E. / Grosser, V. / Becker, K.-F. et al. | British Library Conference Proceedings | 2003


    Using Micro Devices in Automotive Applications

    Schmidt, M. | British Library Conference Proceedings | 2001


    Qualification guidelines for automotive packaging devices

    Raghunathan, R. / Sitaraman, S.K. | Tema Archiv | 2000


    Microsystems packaging for automotive applications

    Jung, E. / Wiemer, M. / Grosser, V. et al. | Tema Archiv | 2002


    Microsystems Packaging for Automotive Applications

    Jung, E. / Wiemer, M. / Grosser, V. et al. | British Library Conference Proceedings | 2002