1–50 von 184 Ergebnissen
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    A "Closed Loop'' System for the Realtime Control of Solder Paste Stencil Printing

    Chung, C.-W. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    A Computational Model for Forced Convection Cooling in Electronic Components

    Olivos, T. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    A Decision-Support Tool for Printed Circuit Board Assembly

    Ong, N. S. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    A DECOMPOSITION METHODOLOGY FOR SCHEDULING SEMICONDUCTOR TEST OPERATIONS FOR NUMBER OF TARDY JOB MEASURES

    Yoo, Wook-Sung | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Adhesive Flip Chip Bonding in a Miniaturized Spectrometer

    Rusanen, O. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Adhesive Flip Chip Bonding on Flexible Substrates

    Aschenbrenner, R. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Advanced superfine-pitch technology

    Wakigawa, Asahiro | Online Contents | 1994
    Verlag: World Scientific , Singapore

    A Framework for the Flexible Grouping of Products for Disassembly

    Viswanathan, S. | Online Contents | 1999
    Verlag: World Scientific , Singapore

    A fuzzy management decision support system for scenario analysis

    Khoo, L. P. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    A low-cost automated handling system for SPC evaluation of packaging processes

    Yeo, S. H. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Alternative substrates for power electronic circuits : an experimental evaluation

    Barnwell, Peter | Online Contents | 1993
    Verlag: World Scientific , Singapore

    A Model to Explain SMT Open Circuit Joints Associated with Adjacent Solder Bridges

    Whalley, D. C. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    Analysing the strategic implications of interconnect technologies

    Dolan, T. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Analysis and Experiments of Ball Deformation for Ultra-Fine-Pitch Wire Bonding

    Zhong, Z. | Online Contents | 2000
    Verlag: World Scientific , Singapore

    Analysis of Design Efficiency for the Disassembly of Modular Electronic Products

    Veerakamolmal, P. | Online Contents | 1999
    Verlag: World Scientific , Singapore

    Analysis of despatching policies in semiconductor post-test operations

    Azrak, Marijean | Online Contents | 1993
    Verlag: World Scientific , Singapore

    ANALYSIS OF NATURAL RESTING ASPECTS OF COMPLEX PARTS

    Ngoi, B. K. A. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Analysis of Process Errors and Production Yield for Surface Mounted Printed Circuit Assembly

    Linn, R. J. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    Analysis of the Directional Wave Spectrum from Field Data

    Hashimoto, N. | British Library Online Contents | 1997
    Verlag: WORLD SCIENTIFIC PUBLISHING CO. PTE. LTD.

    Analysis of Underfill Encapsulation Curing Deformations on Flip Chip on Boaxd (FCOB) Package Reliability

    Pang, J. H. L. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    Analytical Forced Convection Modeling of Plate Fin Heat Sinks

    Teeristra, P. | Online Contents | 2000
    Verlag: World Scientific , Singapore

    Analyzing the Natural Resting Aspects of a Component by its Centroid Solid Angle

    Ngoi, B. K. A. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    Analyzing the Natural Resting Aspects of Plastic Parts in a Vibratory Bowl Feeder

    Ngoi, B. K. A. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    An Analysis of Dispatching Rules in a Semiconductor Wafer Fabrication Environment

    McCutchen, T. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    An Approximate Model for Predicting the Size and Shape of Wave-Soldered Surface-Mount Joints

    Nambisan, B. U. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    An Efficient Assembly Sequencing Heuristic for Printed Circuit Board Configurations

    Moyer, L. K. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    An Experimental Study of the Self Centering of BGA Packages

    Huang, Y.-W. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    An Integrated Decision-Support Environment for DFX Audit

    Souza, R. B. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    An Integrated Methodology for Surface Mount PCB Configuration

    Xu, Z. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    An Integrated Rapid Modeling Environment for Managing Wafer Fabrication Facilities

    Souza, R. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    An intelligent decision support environment for PCB assembly

    Soon, Chong Chin | Online Contents | 1994
    Verlag: World Scientific , Singapore

    ANISOTROPIC ADHESIVES FOR FLIP-CHIP BONDING

    Kivilahti, J. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    Anisotropic Conductive Adhesives for Chip on Glass and Other Flip Chip Applications

    Noort, H. M. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    A NOVEL CIRCUIT FABRICATION TECHNIQUE USING OFFSET LITHOGRAPHY

    Ramsey, B. J. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Application of Dielectric Binary Mixtures in Electronic Cooling Nucleate Pool Boiling Regime

    Lee, T.-Y. T. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Application of ink screening models to solder paste printing in SMT assembly

    Mannan, S. H. | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Application of Polymer-Thick-Film-Technology (PTF) for Environmentally Friendly Electronic Devices

    Fischer, T. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    A Practical Algorithm for Cyclic Hoist Scheduling in a PCB Manufacturing Facility

    Mak, R. W. T. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    A Review of PCB Design for In-Circuit Testability Guidelines and Systems

    Gallagher, C. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    A Review on Cooling by Channel Flow Boiling for Electronic Systems

    Xu, G. P. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    A REVIEW ON DIRECT LIQUID COOLING CHANNEL FLOW WITH SINGLE-PHASE FOR ELECTRONIC SYSTEMS

    Xu, G. P. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    Asia's manufacturing industry gearing up for the high-value electronics market

    Lee, Loke Chong | Online Contents | 1994
    Verlag: World Scientific , Singapore

    A Simulation of Evaporating Meniscus-Driven Flow for Application to Electronics Cooling Design

    Tso, C. P. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    A Study of Solderability and Solder Spreading for SMT Open Joints

    Teo, K. C. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    A Study on Wettability and Defects Behavior of Flow-Soldered Joint Using Low Residue Flux

    Choi, M. K. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    Automatic Process Planning System for the Manufacture of Unpopulated Printed Circuit Boards

    Law, H. -W. | Online Contents | 1996
    Verlag: World Scientific , Singapore