1–20 von 230 Ergebnissen
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Ihre Suche:
publisher:("World Scientific")

    Yield Estimation Through Component Placement Accuracy Evaluation in Surface Mount PWB Assembly

    Shih, W. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    Wire bond parameter optimization study

    Viloria, E. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    What are the design and manufacturing couplings for electronics products?

    Williams, D. J. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Tolerance analysis and synthesis across assemblies : state-of-the-art review

    Ngoi, Bryan Kok Ann | Online Contents | 1994
    Verlag: World Scientific , Singapore

    The world of 5G / Quan Xue (South China University of Technology), editor in chief ; volume 4: Intelligent transportation

    Xu, Zhiqiang | TIBKAT | 2022
    Verlag: World Scientific , New Jersey , London , Singapore , Beijing , Shanghai , Hong Kong , Taipei , Chennai , Tokyo

    The use of electronic speckle pattern interferometry in electronics manufacturing process modelling

    Ogunjimi, A. O. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    The Solderability Evaluation of Surface Mount Components Through the Use of Wetting Balance Analysis

    Huang, C.-Y. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    The Singapore and Malaysia Electronics Industries : D. Beane, A. Shukla and M. Pecht (Book review)

    Tilley, K. J. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    The significance of desoldering and resoldering methods in robotic automated rework

    Geren, N. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Thermoelectric energy conversion devices and systems

    Yazawa, Kazuaki / Bahk, Je-Hyeong / Šakūrī, ʿAlī | TIBKAT | 2021
    Verlag: World Scientific , Singapore

    Thermal Model of a Component Package for System Level Applications

    Teng, S. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Thermal Management for the Robustness Improvement of Double Sided SMT Solder Reflow

    Lee, N. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    THERMAL DISSIPATION CHARACTERISTICS OF A TAPE AUTOMATED BONDING ELECTRONIC PACKAGE

    Yang, L. Y. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    Thermal analysis of IC packages and printed circuit boards

    Tay, A. A. O. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    The Performance of Vibrating Squeegee in the Stencil Printing of Solder Pastes

    Ekere, N. N. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    Theory and methods of photovoltaic material characterization : optical and electrical measurement techniques

    Ahrenkiel, Richard K. / Ahrenkiel, Phil | TIBKAT | 2019
    Verlag: World Scientific , New Jersey , London , Singapore , Beijing , Shanghai , Hong Kong , Taipei , Chennai , Tokyo

    The Origin and Prevention of Post Reflow Defects in Surface Mount Assembly

    Teo, K. C. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    The Limits of Automating Electronic Component Rework

    Geren, N. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    The Impacts of Variability on Scheduling Approaches for a Printed Wiring Boaxd Assembly Operation

    Pfund, M. | Online Contents | 2002
    Verlag: World Scientific , Singapore