Optimization of PCB Component Placement Using Genetic Algorithms
Component to Multi-Track Feeder Assignment and Boaxd Sequencing in Printed Circuit Boaxd Assembly
The Impacts of Variability on Scheduling Approaches for a Printed Wiring Boaxd Assembly Operation
Economic Sensitivity for End of Life Planning and Processing of Personal Computers
Modeling of Material Handling Hoist Operations in a PCB Manufacturing Facility
Scheduling of Printed Wiring Board Assembly in Surface Mount Technology Lines
Neural Network Open Loop Control System for Wave Soldering
Paxametric Studies of Microchannel Conjugate Liquid Flows with Zeta Potential Effects
Analysis and Experiments of Ball Deformation for Ultra-Fine-Pitch Wire Bonding
Models to Estimate Printed Circuit Board Fabrication Yield During the Design Stage
Direct Immersion Cooled Microelectronics Heat Sinks: Effects of Test Fluid and Bonding Technique
Analytical Forced Convection Modeling of Plate Fin Heat Sinks
Evaluation of Plasma Treated HASL Finish PCBs Using DCA Measurements
Design Considerations of High Heat Flux Heat Pipe Evaporators
Properties of Conductive Adhesives Based on Anhydride-Cured Epoxy Systems
Printed Circuit Board Manufacturing and Testing of RIMM[TM]
The "Green Design Advisor": A Tool for Design for Environment
Product End-of-Life Strategy Categorization Design Tool
Computer Take-back and Recycling: An Economic Analysis for Used Consumer Equipment
Analysis of Design Efficiency for the Disassembly of Modular Electronic Products
Solder Paste Deposition Through High Speed Stencil Printing for a Contract Assembly Environment
An Integrated Methodology for Surface Mount PCB Configuration
Failure Mechanisms in Semiconductor Devices : E. Ajith Amerasekera and Farid N. Najm (Book review)
Electronic Products at their End-of-Life: Options and Obstacles
A Framework for the Flexible Grouping of Products for Disassembly
PCB Assembly Line Setup Optimization Using Component Commonality Matrices
Manufacturing Analysis of Underfill Processing for Low-Cost Flip Chip Assembly
SMT Compatible No-Flow Underfill for Solder Bumped Flip Chip on Low-Cost Substrates
Micro-Jet Printing of Polymers and Solder for Electronics Manufacturing
A Practical Algorithm for Cyclic Hoist Scheduling in a PCB Manufacturing Facility
An Integrated Rapid Modeling Environment for Managing Wafer Fabrication Facilities
A Study on Wettability and Defects Behavior of Flow-Soldered Joint Using Low Residue Flux
Efficient Heuristics for Drilling Route Optimization in Printed Circuit Board Manufacturing
Solder Paste Tests for the 'AART' Process
The Singapore and Malaysia Electronics Industries : D. Beane, A. Shukla and M. Pecht (Book review)
Finite Element Modeling of Heat Transfer in Chip on Tape Packages
Modeling of Acid Copper Electroplating : A Review
Book Review: Conductive Adhesives in Electronics Packaging (J. Liu)
Laser Removal of Flux Residue Before Chip Attachment to Board in a Flip Chip Assembly
ENVIRONMENTAL CONCERNS AND RECYCLING/DISASSEMBLY EFFORTS IN THE ELECTRONICS INDUSTRY
Reliability Testing on Flip Chip Joining with Isotropically-Conductive Adhesives
Analysis of Process Errors and Production Yield for Surface Mounted Printed Circuit Assembly
A Study of Solderability and Solder Spreading for SMT Open Joints