Wirebonding on multilayer circuits for automotive applications using robust thick-film conductors
Why use PEMs in military equipment: Users' response
Vibration-induced fatigue failures in bonding wires used in stacked chip modules
Ueber die Entwicklung eines Kraftstoffverbrauchs-Messgeraets
Thermal characterisation and heat transfer analysis of a wire bond chip-on-board package
Thermal analysis of a high density TMOS used in an automotive solide-state relay
The prediction of the radiation-stimulated failure rate for integrated circuits
The past, present and future of EEE components for space application; COTS-the next generation
The Influence of Knowledge Accumulation on Buyer-Supplier Codevelopment Projects
The ACE family of MIL-STD-1553 terminals gets smaller
SRAM based re-programmable FPGA for space applications
Soldered flip chip IC's in automotive applications
Single event latchup threshold estimation based on laser dose rate test results
Single event gate rupture in thin gate oxides
Qualification of plastic encapsulated microcircuits (PEM) for avionics