1–6 von 6 Ergebnissen
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    Reliability potential of epoxy based encapsulants for automotive applications

    Braun, T. / Becker, K.F. / Koch, M. et al. | Tema Archiv | 2005
    Schlagwörter: Kraftfahrzeugelektronik

    Packaging of micro devices for automotive applications - techniques and examples

    Jung, E. / Grosser, V. / Becker, K.F. et al. | Tema Archiv | 2003
    Schlagwörter: Kraftfahrzeugelektronik

    Integration of micro-mechatronics in automotive applications

    Ansorge, F. / Becker, K.F. / Michel, B. et al. | Tema Archiv | 2001
    Schlagwörter: Kraftfahrzeugelektronik

    Accelerated testing of flip chip packages under dynamic load

    Rau, I. / Miessner, R. / Liebing, G. et al. | Tema Archiv | 2001
    Schlagwörter: Kraftfahrzeugelektronik

    Results of assembly and reliability investigation of an MCM-L for an automotive application: electronic control unit

    Joly, J. / Lambert, D. / Ansorge, F. et al. | Tema Archiv | 1998
    Schlagwörter: Kraftfahrzeugelektronik

    Recent progress in flexible moulding and reliability investigation of CSP and BGA-packages using advanced interconnection technology

    Ansorge, F. / Becker, K.F. / Ehrlich, R. et al. | Tema Archiv | 1997
    Schlagwörter: Kraftfahrzeugelektronik