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    Reliability potential of epoxy based encapsulants for automotive applications

    Braun, T. / Becker, K.F. / Koch, M. et al. | Tema Archiv | 2005

    High temperature potential of flip chip assemblies for automotive applications

    Braun, T. / Becker, K.F. / Sommer, J.P. et al. | Tema Archiv | 2005

    Packaging of micro devices for automotive applications - techniques and examples

    Jung, E. / Grosser, V. / Becker, K.F. et al. | Tema Archiv | 2003

    Packaging of Micro Devices for Automotive Applications

    Jung, E. / Grosser, V. / Becker, K.-F. et al. | British Library Conference Proceedings | 2003