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    Junction-to-case thermal resistance-still a myth?

    Dutta, V.B. | Tema Archiv | 1988
    Schlagwörter: THERMAL RESISTANCE MEASUREMENT , JUNCTION-TO-CASE THERMAL RESISTANCE , MEASUREMENT CONDITIONS

    Transient thermal impedance considerations in power semiconductor applications

    Hopkins, T. / Tiziani, R. | Tema Archiv | 1989
    Schlagwörter: COST-EFFECTIVE THERMAL DESIGN , TRANSIENT THERMAL IMPEDANCE , PULSED CONDITIONS