1–5 von 5 Ergebnissen
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    Influence of curing conditions on engineering properties of controlled low strength material made with cementless binder

    Do, Tan Manh / Kim, Young-sang / Dang, My Quoc | Online Contents | 2017
    Schlagwörter: curing conditions , thermal conductivity

    Knock criteria for aviation diesel engines

    Meininger, Rik D | Online Contents | 2017
    Schlagwörter: Flight conditions , Thermal stresses

    A spherical dome in the temperature field

    Gur’yanov, N. G. / Tyuleneva, O. N. | Online Contents | 2013
    Schlagwörter: boundary conditions , thermal conduction

    Transient thermal impedance considerations in power semiconductor applications

    Hopkins, T. / Tiziani, R. | Tema Archiv | 1989
    Schlagwörter: COST-EFFECTIVE THERMAL DESIGN , TRANSIENT THERMAL IMPEDANCE , PULSED CONDITIONS

    Junction-to-case thermal resistance-still a myth?

    Dutta, V.B. | Tema Archiv | 1988
    Schlagwörter: THERMAL RESISTANCE MEASUREMENT , JUNCTION-TO-CASE THERMAL RESISTANCE , MEASUREMENT CONDITIONS