With the down-sizing of terminals for automobiles, the demand for higher quality copper materials has risen dramatically. CAC60, the nominal composition of Cu-1.8 % Ni-0.4 % Si-1.1 % Zn-0.1 % Sn-0.01 % Mg has a yield strength of 580 N/mm2 and an electrical conductivity of 47 % IACS, and also has excellent bend-formability (U-bendable at the 0 radius). Furthermore, the addition of small amounts of tin and magnesium and heat-treatment for the homogeneous dispersion of fine Ni2Si particles reduces stress relaxation to less than 20 % even after being heat-treated at 433 K for 1000 hours. Pairs of tin and magnesium atoms trap vacancies and dislocations, and thereby improve the stress relaxation resistance. CAC60 is one of the most suitable copper alloys for small terminals used under high temperatures near engines.


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    Titel :

    Stress relaxation resistance improvement throught trace element amounts of Cu-Ni-Si alloy


    Weitere Titelangaben:

    Verbesserung der Beständigkeit gegen Spannungsrelaxation durch Spurenelementgehalte in einer Cu-Ni-Si-Legierung
    Titel japanisch


    Beteiligte:
    Ogura, Tetsuzo (Autor:in)


    Erscheinungsdatum :

    1998


    Format / Umfang :

    4 Seiten, 6 Bilder, 4 Tabellen, 14 Quellen



    Medientyp :

    Aufsatz (Zeitschrift)


    Format :

    Print


    Sprache :

    Japanisch