Extremely thin silicon solar cells are of interest for space applications. Performance models show that a surface-passivated, light-trapping silicon solar cell can have optimum thicknesses as thin as 5 mu m, and maintain high efficiency down to thicknesses of under 2 mu m. Such cells have specific power and extremely good radiation damage tolerance, as well as high efficiency. New methods of fabricating and handling such thin light-trapping cells using epitaxial growth on a removable substrate are discussed. The substrate provides mechanical support to reduce breakage. When the substrate is removed, a transparent glass superstrate provides the mechanical support. By using a process technology in which a sacrificial lattice-matched CaF2 is used, it is possible to re-use the single-crystal substrate.
A process sequence for manufacture of ultra-thin, light-trapping silicon solar cells
Eine Prozeßfolge für die Fertigung ultradünner, lichteinfangender Siliciium-Sonnenzellen
Solar Cells ; 29 , 2-3 ; 257-266
1990
10 Seiten, 21 Quellen
Aufsatz (Zeitschrift)
Englisch
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