The Starship turboprop commuter airplane incorporates advanced aerodynamic design and is equipped with the latest in avionics. High-density packaging is achieved by combining increased device integration, surface mounting, and efficient mechanical design.
Packaging avionics with SMT and gate arrays
Packungstechnologie in der Avionik mit Oberflaechenmontagetechnologie und Gate Arrays
Electronic Packaging and Production ; 28 , 8 ; 28-31
1988
4 Seiten
Aufsatz (Zeitschrift)
Englisch
Packaging requirements (avionics)
Tema Archiv | 1990
|Modular avionics packaging standardization
AIAA | 1984
|Modular Avionics Packaging (MAP)
NTIS | 1977
Avionics require high density packaging
Tema Archiv | 1993
|