Electronic packaging for advanced Department of Defense (DoD) electronic systems places a high premium on lightweight systems with high efficiency and reliability, and reduced life cycle costs. High priority packaging needs stress advanced thermal management mechanisms combined with lightweight, high specific property material systems. Continued electronic circuit miniaturization, coupled with increased performance requirements and severe military mechanical/environmental constraints systems results in ever-increasing circuit power densities and dissipation levels. This results in the need for advanced, innovative packaging and thermal management techniques. Electronic system packaging utilizing direct-immersion two-phase fluorocarbon fluid coolants in a subcooled forced flow scheme and high specific property composite materials is under investigation in a joint effort by the Naval Air Warfare Center, Aircraft Division, Indianapolis (NAWC Indianapolis) and the Purdue University Boiling and Two-Phase Flow Laboratory (BTPFL).
Advanced electronics packaging utilizing direct-immersion two-phase forced convection subcooled coolant and high specific property advanced materials
Fortentwickelte Elektronikanordnung mit direktem Eintauchen in ein unterkühltes zweiphasiges Kühlmittel mit Zwangskonvektion und Werkstoffen mit hohen spezifischen Eigenschaften
1992
9 Seiten, 5 Bilder, 4 Quellen
Aufsatz (Konferenz)
Englisch
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