Over the past two years, a diverse group of experts representing both suppliers and users has been working to revise the Military Metal Clad Laminate and Prepreg specification, MIL-P-13949G. MIL-P-13949 is the document used for establishing technical requirements for both military and commercial procurement of substrate materials used in the fabrication of printed wiring boards. Like any specification, the need for technical update is mandatory. As the end use requirements for printed wiring boards becomes more and more stringent, including surface mount technology, matching impedances, coefficient of thermal expansion matching, etc. the need for updated (and in some cases more stringent) requirements is also placed on material suppliers. While existing MIL-P-13949G is generally considered a solid document, there are several technical 'changes' currently proposed for the next revision (Revision H). The following is a compilation of the most significant changes to date.
MIL-S-13949 revision H update
Fortentwicklung der Norm MIL-S-13949
1991
3 Seiten
Aufsatz (Konferenz)
Englisch
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